HBF，存储芯片巨头出招

Core Viewpoint - SK Hynix and SanDisk have launched a global standardization strategy for High Bandwidth Flash (HBF), aimed at enhancing the AI ecosystem during the inference phase of artificial intelligence [1][2]. Group 1: HBF Overview - HBF is a new memory layer positioned between high-speed memory (HBM) and high-capacity storage devices (SSD), addressing the gap between HBM's performance and SSD's capacity [2]. - HBF is expected to improve the scalability of AI systems while reducing total cost of ownership (TCO), with significant demand growth anticipated for hybrid storage solutions by 2030 [2]. Group 2: Industry Implications - In the AI inference market, system-level optimization involving CPU, GPU, memory, and storage is more critical for competitiveness than the performance of individual chips [2]. - Providers that can offer integrated memory solutions combining both HBM and HBF will play an increasingly important role in the industry [2]. Group 3: Strategic Collaboration - SK Hynix and SanDisk plan to advance the rapid standardization and commercialization of HBF, leveraging their design, packaging technologies, and large-scale production experience in HBM and NAND [2][3]. - The focus is on optimizing the entire AI infrastructure ecosystem rather than competing on the performance of individual technologies [3].