芯片的这个问题，越来越难

Group 1 - The core issue in the semiconductor industry has shifted from visible contamination to atomic-scale contamination, where even trace materials can significantly alter surface behavior and device performance [4][10][29] - As technology nodes advance, the acceptable levels of contamination have drastically decreased, requiring precision at the atomic layer deposition level [7][8] - Modern contamination mechanisms are often hidden and accumulate over time, making them difficult to detect and manage, leading to reliability risks rather than immediate yield losses [19][22][30] Group 2 - Traditional pollution control methods focused on preventing harmful substances from entering the manufacturing environment, but at atomic scales, the focus must also include residual materials [4][10] - The impact of contamination is often indirect, manifesting as variability in device performance rather than discrete defects, complicating detection and classification [14][15] - Effective contamination management now requires a holistic approach that integrates material selection, tool design, process flow, and data analysis, rather than relying solely on cleaning [27][30]