半导体芯闻·2026-03-09 10:34Core Insights - The demand for AI chips is rapidly increasing, making advanced packaging technology in the semiconductor industry a critical component [1] - TSMC's CoWoS packaging capacity is under long-term strain, prompting some AI chip clients to explore alternatives, with Intel's EMIB packaging technology gaining attention [1] - The competitive landscape for advanced packaging is intensifying, with potential collaboration deals reaching tens of billions annually [1] Group 1: TSMC and Intel's Packaging Technologies - TSMC's CoWoS utilizes a complete "silicon interposer" as a chip interconnection platform, offering high bandwidth performance but at a higher cost and longer expansion cycle due to significant silicon material usage [2] - Intel's EMIB employs a localized "silicon bridge" architecture, embedding silicon only in areas requiring high-speed interconnects, which reduces material costs and packaging size while maintaining high performance [2] Group 2: Market Dynamics and Client Interest - Major cloud service providers (CSPs) are actively developing their own AI chips, highlighting the importance of advanced packaging technology, which is now on par with wafer manufacturing [2] - Tech giants like NVIDIA, Google, and Meta are reportedly evaluating the integration of Intel's packaging solutions in their next-generation AI ASICs or accelerators, indicating a potential shift in the advanced packaging competitive landscape [2]