【热管理好会，点开便知】

Core Viewpoint - The article discusses the upcoming "5th Advanced Thermal Management Technology Summit and AI and AI Intelligent Agent Developer Forum" scheduled for March 23-24, 2026, in Shanghai, China, focusing on opportunities and challenges in thermal management technology across various sectors, including AI servers, automotive electronics, humanoid robots, and high-performance chips [3][4]. Group 1: Event Overview - The summit will feature over 70 speakers and 600 industry experts, covering key topics such as AI server data centers, automotive electronics, humanoid robots, and smart terminals [4]. - The event will include a main conference and four specialized sessions, focusing on high-performance and high-power chip thermal management technology [4]. Group 2: Key Topics and Technologies - Key technologies discussed will include AI and AI intelligent agents, AI server data centers, smart terminals, humanoid robots, high-performance and high-power chips, high thermal conductivity materials, and microchannel cooling technology [4]. - Specific sessions will address liquid cooling technologies, embedded microfluidic cooling, and thermal management solutions for AI computing infrastructure [5][6]. Group 3: Participating Companies and Presentations - Notable companies participating include ZTE Corporation, Lenovo, and Ansys, presenting on topics such as high-power liquid cooling technology and thermal simulation solutions [5][15]. - Various universities and research institutions, including Peking University and Xiamen University, will also present their findings on advanced thermal management technologies [6][17]. Group 4: Industry Challenges and Innovations - The summit will explore challenges in thermal management for electric vehicle motor controllers and the principles of automotive thermal management design [8][23]. - Innovations in thermal management for humanoid robots will be discussed, focusing on key difficulties such as high power density and dynamic coupling effects [7][22].