全球先进封装市场新格局：AI驱动下的“三足鼎立”

Core Viewpoint - The global advanced packaging market is undergoing significant changes, with an estimated market size of $59.2 billion in 2025, reflecting a 25% year-on-year growth, and is expected to continue steady growth over the next five years [1]. Group 1: Market Leaders - TSMC and Intel lead the global advanced packaging industry, holding a combined 35% market share in the top 10, thanks to their advancements in 2.5D/3D packaging and glass substrate technologies [2]. - The demand for high-performance computing chips drives the necessity for advanced packaging technologies such as COWOS, EMIB, 3D SoIC, and Foveros, indicating a strong international market demand and the importance of technological depth [2]. Group 2: Key Players in Packaging - The top ten OSAT (Outsourced Semiconductor Assembly and Test) companies are crucial to the global advanced packaging capacity, serving markets like consumer electronics and automotive electronics through scalable manufacturing capabilities [3]. - Notably, three companies from mainland China are ranked among the top ten, with all showing double-digit revenue growth in advanced packaging for 2025, reflecting the strategic success of China's market demand and technological self-sufficiency [3]. - Sony, Samsung, and SK Hynix represent specific IDM (Integrated Device Manufacturer) capabilities in advanced packaging, with Sony leading in global shipments of CIS image sensors, while Samsung and SK Hynix see revenue growth driven by AI storage chips and increased orders for HBM products [3].