SEMICON展后分享：异构集成与先进封装技术已然成为产业圈发展共识

Core Insights - The article highlights the significant growth and developments in the advanced packaging and heterogeneous integration sectors of the semiconductor industry, driven by increasing demand from artificial intelligence and data centers [3]. Group 1: Industry Events and Trends - The SEMICON China exhibition showcased a strong focus on high-end semiconductor equipment, with both international and domestic manufacturers emphasizing their advancements in the advanced packaging sector [2]. - Major international companies like Canon, ASML, and SCREEN presented wafer-level and panel-level lithography equipment, while domestic leaders such as North Huachuang and Shengmei Shanghai displayed equipment for 2.5D/3D heterogeneous integration [2]. - The advanced packaging and heterogeneous integration industries are accelerating the global semiconductor market towards a valuation of $1 trillion [2]. Group 2: Market Statistics and Projections - According to TrendBank, the global advanced packaging market is projected to reach $59.2 billion by 2025, reflecting a growth rate of 25% [3]. - The panel-level packaging (PLP) market is expected to grow to $247 million by 2025, with a remarkable growth rate of 40% [3]. - The current demand for 2.5D/3D packaging in China is limited due to constraints in advanced wafer orders, indicating that the market has not yet reached a peak demand phase [3]. Group 3: Strategic Players - Key players in the 2.5D/3D and FOPLP sectors include companies like Tongfu Microelectronics, Huatian Technology, and Xiamen Yuntian, among others, each focusing on specific advanced packaging technologies [4].