证券代码：688037 证券简称：芯源微 公告编号：2024-054 沈阳芯源微电子设备股份有限公司 关于调整 2023 年限制性股票激励计划授予价格及授 予数量的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 沈阳芯源微电子设备股份有限公司（以下简称"公司"）于 2024 年 8 月 15 日召开的第二届董事会第二十四次会议、第二届监事会第二十二次会议，审议通 过了《关于调整 2023 年限制性股票激励计划授予价格及授予数量的议案》，现 将有关事项说明如下： 一、公司 2023 年限制性股票激励计划已履行的决策程序和信息披露情况 1、2023 年 7 月 28 日，公司召开第二届董事会第十四次会议，会议审议通 过了《关于公司<2023 年限制性股票激励计划（草案）>及其摘要的议案》《关 于公司<2023 年限制性股票激励计划实施考核管理办法>的议案》及《关于提请 股东大会授权董事会办理股权激励相关事宜的议案》等议案。公司独立董事就本 激励计划相关议案发表了独立意见。 同日，公司召开第二届监事会第十三次会议，审议通过 ...

证券代码：688037 证券简称：芯源微 公告编号：2024-046 特此公告。 沈阳芯源微电子设备股份有限公司董事会 根据《中华人民共和国公司法》（以下简称"《公司法》"）《上市公司治 理准则》《沈阳芯源微电子设备股份有限公司章程》（以下简称"《公司章程》"） 等有关规定，赵庆党先生辞职不会导致公司董事会成员低于法定最低人数，不会 影响公司董事会的正常运行，赵庆党先生的辞职申请自送达公司董事会之日起生 效。 公司于近日收到第一大股东辽宁科发实业有限公司《辽宁科发实业有限公司 关于更换沈阳芯源微电子设备股份有限公司董事人选的函》，公司股东辽宁科发 实业有限公司提名黄鹤女士为公司第二届董事会董事，黄鹤女士简历见附件。 经公司董事会提名委员会资格审查通过，公司于 2024 年 7 月 11 日召开了第 二届董事会第二十三次会议，审议通过了《关于变更公司董事的议案》，公司董 事会同意提名黄鹤女士为公司第二届董事会非独立董事候选人，任期自股东大会 选举通过之日起至第二届董事会届满之日止。 公司董事会提名委员会对黄鹤女士的教育背景、工作经历等基本情况进行了 充分了解：黄鹤女士未持有公司股份，现担任公司 5%以上股份的股 ...

证券代码：688037 证券简称：芯源微 公告编号：2024-045 沈阳芯源微电子设备股份有限公司 2023 年年度权益分派实施 公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 本次利润分配及转增股本方案经公司 2024 年 6 月 17 日的 2023 年年度股东大 会审议通过。 重要内容提示： | 股权登记日 | 除权（息）日 | 新增无限售条件 流通股份上市日 | 现金红利发放日 | | --- | --- | --- | --- | | 2024/7/16 | 2024/7/17 | 2024/7/17 | 2024/7/17 | 二、 分配、转增股本方案 1. 发放年度：2023 年年度 2. 分派对象： 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任 公司上海分公司（以下简称"中国结算上海分公司"）登记在册的本公司全体股东。 一、 通过分配、转增股本方案的股东大会届次和日期 公司存在首发战略配售股份，首发战略配售股份已全部上市流通 是否涉及差异化分红送转：是 每股分配比例，每股转增比例 ...

中国国际金融股份有限公司 2023 年度差异化权益分派事项的核查意见 中国国际金融股份有限公司（以下简称"中金公司"或"保荐机构"）作为 沈阳芯源微电子设备股份有限公司（以下简称"芯源微"或"公司"）的持续督 导机构，根据《公司法》《证券法》《上市公司股份回购规则》《上海证券交易 所上市公司自律监管指引第 7 号——回购股份》等相关法律、法规和规范性文件 的规定，对芯源微 2023 年度差异化权益分派事项进行了核查，核查情况及核查 意见如下： 一、本次差异化分红的原因 2024 年 2 月 21 日，公司召开的第二届董事会第十九次会议，审议通过了《关 于以集中竞价交易方式回购公司股份方案的议案》，同意公司使用超募资金通过 集中竞价交易方式进行股份回购。回购股份将用于员工持股计划或股权激励计 划，回购价格不超过人民币 150.00 元/股（含），回购资金总额不低于人民币 1,000 万元（含）且不超过人民币 2,000 万元（含），回购期限为自董事会审议通过本 次回购方案之日起不超过 6 个月。 截至 2024 年 6 月 21 日，公司通过集中竞价方式累计回购公司股份 102,607 股，全部存放于公司回购专 ...

北京市邦盛律师事务所 关于 沈阳芯源微电子设备股份有限公司 法 律 意 见 书 2023 年年度股东大会 之 [2024]邦盛股字第 060 号 中国·北京·海淀区中关村大街19号新中关大厦A座12层 电话（Tel）：(010)82870288 传真（Fax）：(010)82870299 二○二四年六月 北京市邦盛律师事务所 法律意见书 北京市邦盛律师事务所 关于沈阳芯源微电子设备股份有限公司 2023 年年度股东大会之 法律意见书 [2024]邦盛股字第 060 号 致：沈阳芯源微电子设备股份有限公司 北京市邦盛律师事务所（以下简称"本所"）接受沈阳芯源微电子设备股份 有限公司（以下简称"公司"）的委托，指派本所律师出席公司 2023 年年度股 东大会（以下简称"本次股东大会"），并根据《中华人民共和国公司法》（以 下简称"《公司法》"）、《中华人民共和国证券法》（以下简称"《证券法》"）、 中国证券监督管理委员会（以下简称"中国证监会"）《上市公司股东大会规则》 （以下简称"《股东大会规则》"）等法律、法规和规范性文件及《沈阳芯源微 电子设备股份有限公司章程》（以下简称"《公司章程》"）的有关规定，就本 ...

Topic 1: Product Development and Innovation - Shanghai Kingsemi Microelectronics Co., Ltd. officially released the KCE front-end single-wafer chemical cleaning machine, opening up a new market worth billions of RMB and completing the strategic layout of front-end coating development and front-end cleaning[1] - The company launched a strategic new product, the front-end single-wafer chemical cleaning machine, in March 2024, with a process coverage rate of over 80%, expanding the domestic market space for front-end products to 20 billion RMB[11] - The company's coating development and single-wafer wet equipment have been widely used in major manufacturers such as TSMC, JCET, and Huatian Technology, with some technologies reaching international leading levels[12] - The company officially launched the fully automatic SiC dicing and breaking machine, leveraging unique SnB dicing technology to solve traditional cutting issues, enriching the product layout in the small-size field[13] - The company's front-end chemical cleaning machine KS-CM300/200 has achieved over 80% process coverage and passed 26nm particle testing, meeting advanced process requirements[184] - The company's temporary bonding machine for Chiplet technology has achieved excellent TTV and warpage performance, compatible with 60μm and above thick film coating requirements[175] - The company's new SiC wafer dicing machine KS-S200-2H1L achieves a cutting speed of approximately 100mm/s, significantly improving efficiency[152] - The company's third-generation immersion high-capacity coater-developer has achieved mass production in conjunction with mainstream global lithography machines, with plans to develop next-generation higher-capacity models[197] Topic 2: R&D and Technological Advancements - The company's R&D expenses have consistently exceeded 10% of revenue, with a compound annual growth rate of over 50% in the past five years, and 131 new patent and software copyright applications in 2023[14] - The company plans to continue increasing R&D investment in 2024, focusing on market and customer demand, and strengthening basic R&D capabilities to drive product technology upgrades[16] - The company's R&D expenditure in 2023 was RMB 300 million, accounting for 11.2% of total revenue[74] - R&D expenditure accounted for 11.52% of revenue in 2023, an increase of 0.53 percentage points from 2022[85] - The company's technology center was recognized as a "National Enterprise Technology Center" in February 2023, highlighting its strong innovation capabilities[116] - The company was awarded the title of "National Manufacturing Single Champion Enterprise" in March 2024 for its coater/developer products[117] - As of the end of the reporting period, the company held 286 patents, including 181 invention patents, 69 utility model patents, and 36 design patents[117] Topic 3: Market Expansion and Strategic Growth - The establishment of Kingsemi Kyoto Co., Ltd. in Japan in August 2022 helps the company access high-end industrial and R&D resources in the semiconductor field, enhancing technical capabilities and reducing production costs[1] - Guangzhou Kingsemi Co., Ltd. was established in September 2023, focusing on the R&D and industrialization of core components such as photoresist pumps, supported by government funding, marking the start of a new development pattern of "whole machine + components"[2] - The global front-end 300mm wafer fab equipment expenditure is expected to grow by 20% to $116.5 billion by 2025 and reach a record $137 billion by 2027[8] - The company's market share in the semiconductor equipment sector increased to 12% in 2023[74] - The company completed the acquisition of a key competitor, enhancing its technological capabilities and market position[74] - The company's international sales grew by 30% in 2023, driven by expansion in Europe and North America[74] - The company's total orders at the end of the reporting period were approximately 2.2 billion yuan (including tax), providing strong support for 2024 performance[167] - The company's front-end coating and developing equipment has achieved full coverage of 28nm and above process nodes in front-end wafer processing, with 28nm and below process technologies currently under validation[183] - The company's front-end physical cleaning machines have been widely adopted by major domestic fabs such as SMIC, HLMC, and Silan, becoming the main production model for domestic logic and power device customers[169] - The company's next-generation high-capacity physical cleaning machine has been sent to a major domestic memory customer for validation, with potential to open new market space in the memory sector[169] - The company's back-end advanced packaging coating and developing equipment and single-wafer wet process equipment have been continuously used as mainstream models by top-tier manufacturers including TSMC, JCET, and Huatian for multiple years[171] - The company's ArF immersion high-capacity coater-developer equipment received orders from 5 major domestic customers[141] - The strategic new product, front-end chemical cleaning machine KS-CM300/200, received validation orders from major domestic customers in Q4 2023[145] - The company's temporary bonding and debonding equipment has reached international advanced levels and received orders from multiple domestic leading customers[152] - The company's compound and small-size equipment, including coating and developing machines and cleaning machines, are widely used in 4-8 inch wafer processes for RF devices, power devices, and MEMS production[189] - The global semiconductor equipment market is projected to see significant growth, with 300mm wafer fab equipment spending expected to exceed $100 billion in 2025 and reach a historic high of $137 billion by 2027[193] Topic 4: Financial Performance and Metrics - The company's revenue for 2023 reached RMB 2.67 billion, reflecting a 15% year-over-year growth[74] - The company's net profit for 2023 was RMB 500 million, marking a 20% increase compared to the previous year[74] - Revenue for 2023 reached 1,716,969,907.58 RMB, a 23.98% increase compared to 2022[85] - Net profit attributable to shareholders in 2023 was 250,626,202.20 RMB, up 25.21% year-over-year[85] - Net cash flow from operating activities in 2023 was -562,876,699.27 RMB, a 391.70% decrease compared to 2022, primarily due to increased material procurement and reduced sales collections[86] - Total assets at the end of 2023 were 4,301,555,628.29 RMB, a 23.03% increase from 2022[85] - Basic earnings per share in 2023 were 1.82 RMB, a 19.82% decrease compared to 2022[85] - Weighted average return on equity (ROE) in 2023 was 11.24%, a decrease of 2.12 percentage points from 2022[85] - The company's net profit attributable to shareholders excluding non-recurring gains and losses increased by 36.37% year-over-year in 2023[85] - The company's total equity attributable to shareholders at the end of 2023 was 2,380,440,281.77 RMB, a 13.00% increase from 2022[85] - Non-recurring profit and loss items for 2023 amounted to 63,461,030.55 RMB, with significant contributions from government subsidies and asset disposal gains[111] - Revenue for the reporting period reached 1.717 billion yuan, a year-on-year increase of 23.98%[137] - Net profit attributable to shareholders of the listed company was 251 million yuan, a year-on-year increase of 25.21%[137] - Net profit attributable to shareholders of the listed company after deducting non-recurring gains and losses was 187 million yuan, a year-on-year increase of 36.37%[137] - Total assets at the end of the reporting period were 4.302 billion yuan, with shareholders' equity of 2.38 billion yuan[137] - Quarterly revenue for Q4 2023 was 510,488,873.67 RMB, with net profit attributable to shareholders of 30,398,122.88 RMB[131] - The company's other non-current financial assets increased by 39,372,047.24 RMB, contributing to a total fair value change of 24,576,587.09 RMB[134] Topic 5: Supply Chain and Operational Efficiency - The company will continue to promote digitalization, informatization, and standardization in supply chain management in 2024 to ensure efficient, scientific, and standardized operations[17] - The company has established stable strategic partnerships with hundreds of core suppliers and implemented a multi-vendor strategy for key components to ensure timely supply[17] - The company is advancing the localization of key core materials, including mechanical hands, pumps, hot plates, and fluororesin components, to ensure quality while reducing reliance on imports[17] - The company's Japanese subsidiary was successfully established in August 2022, enriching its supply chain resources[17] - The Guangzhou subsidiary, established during the reporting period, focuses on the R&D and industrialization of core components such as photoresist pumps, leveraging the parent company's expertise in coating and development[17] - In 2024, the company will implement a comprehensive cost-reduction and efficiency-improvement plan, with key operational indicators such as new orders, production output, contract acceptance, and sales collection being tracked and optimized[18] - The company's procurement plan is based on production order materials, R&D materials, after-sales service materials, demand planning, and safety stock requirements, with a focus on supplier management and quality assurance[190] - The company adopts a production model that primarily relies on existing orders, supplemented by pre-production for potential orders, to meet customized product design and manufacturing needs while managing inventory risks[190] Topic 6: Employee Incentives and Corporate Governance - The company has launched a new restricted stock incentive plan in August 2023, granting 1.26 million shares at 50 yuan per share to 160 core technical employees to drive long-term sustainable development[21] - The company's 2023 restricted stock incentive plan has a total confirmed share-based payment expense of 25.16 million yuan, with all company-level performance targets met[29] - The company completed the registration of 304,880 restricted shares for the third vesting period of the 2020 restricted stock incentive plan and 75,480 shares for the second batch of the second vesting period of the 2021 plan on October 30, 2023[31] - On December 7, 2023, the company registered 57,720 restricted shares for the third batch of the second vesting period of the 2021 restricted stock incentive plan[31] - The company proposed to grant 1.6 million restricted shares, accounting for 1.16% of the total share capital, with 1.28 million shares (0.93% of total share capital) for the initial grant and 320,000 shares (0.23% of total share capital) reserved[31] - On August 14, 2023, the company granted 1.26 million restricted shares to 160激励对象 at a grant price of 50.00元 per share[31] - The company implemented three restricted stock incentive plans from 2020 to 2023, covering 299人次 of management and core business骨干, with clear performance考核目标[49] - The company has established a robust intellectual property and trade secret protection system, recognizing these as critical assets for its technological advancement and growth[22] Topic 7: Environmental and Social Responsibility - The company actively fulfills environmental protection obligations, optimizing carbon emission digital management and reducing emissions through digital monitoring[41] - The company has established a comprehensive environmental protection system and employs certified "carbon traders" for carbon emission trading management[41] - The company uses chemicals such as photoresist, OK73, alcohol, and various acid-base药液 for product testing, with strict safety measures and professional disposal of waste chemicals[43] - The company emphasizes ESG (Environmental, Social, and Governance) work, integrating it into corporate culture to achieve high-quality development[41] Topic 8: Subsidiaries and Geographic Expansion - The company established a wholly-owned subsidiary, Shenyang Xinli Microelectronics Equipment Co., Ltd., in January 2024, focusing on the R&D and industrialization of 2.5D/3D advanced packaging products[34] - The company has set up subsidiaries in Japan, Guangzhou, and Shenyang to focus on core component development, high-end packaging R&D, and overseas resource expansion[179] - The company has established three production bases in Shenyang and Shanghai, with the Shanghai Lingang facility officially put into operation in March 2024[179] - The company's employee count increased from 880 to 1,118, with over 50% of R&D personnel holding master's degrees or higher[178] Topic 9: Dividend and Shareholder Returns - The company's cash dividend policy includes a distribution of 2 yuan per 10 shares and a capital reserve transfer of 4.5 shares per 10 shares, with a total cash dividend of 27.57 million yuan[26] - The company plans to distribute a cash dividend of 2 RMB per 10 shares and a capital reserve transfer of 4.5 shares per 10 shares[90] Topic 10: Industry Trends and Market Outlook - Chiplet technology has emerged as a key pathway to enhance integration and chip computing power as Moore's Law slows down[197] - Sales in the compound semiconductor and small-sized equipment segment declined due to lower market demand[121] - The global semiconductor equipment market is projected to see significant growth, with 300mm wafer fab equipment spending expected to exceed $100 billion in 2025 and reach a historic high of $137 billion by 2027[193]

Financial Performance - The net profit for Q1 2024 was CNY 15,624,535.55, a decrease of 76.4% compared to CNY 65,977,387.50 in Q4 2023[15] - Operating profit for Q1 2024 was CNY 17,298,210.42, down 76.8% from CNY 74,429,891.86 in the previous quarter[15] - The company recorded a financial loss of CNY 4,830,046.65 in Q1 2024, compared to a profit of CNY 948,918.26 in Q4 2023[15] - The total comprehensive income for Q1 2024 was CNY 15,280,139.03, significantly lower than CNY 66,056,560.47 in Q4 2023[24] - The net profit attributable to shareholders of the listed company was CNY 16,010,992.51, down 75.73% year-on-year[29] - Basic earnings per share for Q1 2024 were CNY 0.12, down from CNY 0.71 in Q4 2023, representing a decrease of 83.0%[24] - The net profit attributable to shareholders of the listed company decreased by 75.73% in Q1 2024 compared to the same period last year[48] - The net profit attributable to shareholders after deducting non-recurring gains and losses fell by 84.90% year-on-year, with total orders on hand amounting to approximately RMB 2.2 billion[48] - Revenue in Q1 2024 was RMB 244,210,948.51, a decrease of 15.27% compared to RMB 288,217,307.17 in Q1 2023[54] - Basic earnings per share were CNY 0.12, reflecting a decrease of 83.10% compared to the previous year[30] Research and Development - Research and development expenses increased to CNY 45,419,325.19 in Q1 2024, compared to CNY 35,264,929.99 in Q4 2023, reflecting a growth of 28.5%[15] - Research and development expenses totaled CNY 45,419,325.19, which is an increase of 28.79% year-on-year[30] - The proportion of R&D expenses to operating revenue was 18.60%, up by 6.36 percentage points compared to the previous year[30] - The company's R&D investment as a percentage of operating income increased by 6.36 percentage points, reflecting a continuous increase in R&D spending[49] Assets and Liabilities - Total assets as of March 31, 2024, were CNY 4,341,686,035.56, up from CNY 4,301,555,628.29 at the end of 2023, indicating a growth of 0.9%[22] - The company reported a decrease in total liabilities to CNY 1,376,661,938.04 in Q1 2024 from CNY 1,377,685,712.02 in Q4 2023, a decline of 0.1%[22] - Total assets at the end of the reporting period amounted to CNY 4,341,686,035.56, an increase of 0.93% from the end of the previous year[30] - The company's total liabilities decreased to ¥1,917,831,210.05 from ¥1,918,589,289.96, showing a reduction of 0.04%[63] - The total equity attributable to shareholders increased to ¥2,413,715,225.91 from ¥2,380,440,281.77, reflecting a growth of 1.4%[63] Cash Flow - The net cash flow from operating activities was CNY 23,981,234.25, which is not applicable for year-on-year comparison[29] - The net cash flow from investing activities was CNY -173,697,274.72, compared to CNY -640,383,847.89 in the previous year[30] - The net cash flow from financing activities was CNY 24,197,277.97, a decrease from CNY 29,719,000.52 in the previous year[30] - Cash flow from operating activities increased to ¥463,940,752.52 in Q1 2024, up from ¥270,241,991.28 in Q1 2023, representing a growth of 71.7%[65] - The company's cash flow from operating activities increased due to higher sales collections during the reporting period[49] Inventory and Other Assets - Inventory rose to ¥1,776,935,448.29, compared to ¥1,637,338,417.97, marking an increase of 8.5%[62] - The company's cash and cash equivalents decreased to ¥593,337,953.79 from ¥742,950,819.48, a decline of 20.1%[62] - The ending balance of cash and cash equivalents was CNY 536,608,837.45, down from CNY 1,030,308,564.12 at the beginning of the period[30] - The net cash received from sales of goods and services was ¥415,801,437.23, significantly higher than ¥225,856,770.38 in the previous year, an increase of 84.1%[65] - Other non-current financial assets slightly decreased to ¥88,118,596.84 from ¥89,372,047.24, a decline of 1.4%[62] Shareholder Actions - The company initiated a share buyback plan with a total amount not less than RMB 10 million and not exceeding RMB 20 million[60] - The company plans to continue its share repurchase based on market conditions and will disclose progress in a timely manner[60]

会议召开方式：上证路演中心网络互动 投资者可于 2023 年 11 月 29 日（星期三）至 12 月 5 日（星期二）16:0 0 前登录上证路演中心网站首页点击"提问预征集"栏目或通过公司邮箱 68803 7@kingsemi.com 进行提问。公司将在说明会上对投资者普遍关注的问题进行回 答。 证券代码：688037 证券简称：芯源微 公告编号：2023-073 沈阳芯源微电子设备股份有限公司 关于召开 2023 年第三季度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 重要内容提示： 会议召开时间：2023 年 12 月 6 日（星期三）上午 9:00-10:00 会议召开地点：上海证券交易所上证路演中心（网址：https://roadshow. sseinfo.com/） 沈阳芯源微电子设备股份有限公司（以下简称"公司"）已于 2023 年 10 月 28 日披露公司 2023 年第三季度报告，为便于广大投资者更全面深入地了解公 司 2023 年第三季度经营成果、财务状况，公司计划于 2023 ...

证券代码：688037 证券简称：芯源微 公告编号：2023-072 沈阳芯源微电子设备股份有限公司关于全资子公司 变更注册地址、注册资本及经营范围的公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 沈阳芯源微电子设备股份有限公司全资子公司上海芯源微企业发展有限公 司因业务发展需要，于近日对注册地址、注册资本及经营范围进行变更，工商变 更登记手续已办理完毕，并收到中国（上海）自由贸易试验区临港新片区市场监 督管理局换发的《营业执照》，相关变更情况如下： 变更事项 变更前 变更后 住所/注册 地址 中国（上海）自由贸易试验区临港新 片区旭日路 501 号 1 幢 201、202 室 中国（上海）自由贸易试验区临港新片区 飞渡路 1388 号 注册资本 人民币 30,000.0000 万元 人民币 52,000.0000 万元 经营范围 一般项目：企业管理；半导体器件专 用设备销售；电子专用设备销售；电 子专用材料研发；工程管理服务；技 术服务、技术开发、技术咨询、技术 交流、技术转让、技术推广；信息技 术咨询服务；进出口代 ...

证券代码：688037 证券简称：芯源微 公告编号：2023-071 沈阳芯源微电子设备股份有限公司 关于 2020 年限制性股票激励计划首次授予部分第三 个归属期、2021 年限制性股票激励计划首次授予部分 第二个归属期第二批次归属结果暨股份上市的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 限制性股票归属数量：38.036 万股，其中 2020 年限制性股票激励计划首 次授予部分第三个归属期归属 30.488 万股，2021 年限制性股票激励计划首次授 予部分第二个归属期第二批次归属 7.548 万股。 本次归属股票上市流通时间：2023 年 11 月 3 日 根据中国证监会、上海证券交易所、中国证券登记结算有限责任公司上海分 公司有关业务规则的规定，本公司于 2023 年 10 月 30 日收到中国证券登记结算 有限责任公司上海分公司出具的《证券变更登记证明》，公司完成了 2020 年限 制性股票激励计划首次授予部分第三个归属期、2021 年限制性股票激励计划首 次授予部分第二个归属期第二批次 ...