Model Capabilities - Veo 3 is a new video generation model designed for filmmakers and storytellers [1] - The model generates audio natively, including sound effects, ambient noise, and dialogue [1] - Veo 3 excels in physics, realism, and prompt adherence, delivering best-in-class quality [1] Video Content Analysis - The video depicts a hardcore off-road rally with a dynamic, found-footage aesthetic [1] - Heavily modified, unbranded off-road vehicles are engaged in a frenetic race through challenging natural environments [1] - The dominant sounds are powerful engines, transmissions, and the impact of suspension [1] - An 8-second sequence shows a buggy and a truck conquering a river crossing at full speed [1] - The sequence highlights the vehicles' ability to overcome environmental obstacles through sheer force [1]

Product Features - Veo 3 is a new state-of-the-art video generation model designed for filmmakers and storytellers [1] - Veo 3 allows users to add sound effects, ambient noise, and dialogue, generating all audio natively [1] - Veo 3 delivers best-in-class quality, excelling in physics, realism, and prompt adherence [1] Target Audience - The model is designed to empower filmmakers and storytellers [1] Technical Specifications - Veo 3 generates audio natively [1]

SALT LAKE CITY, May 05, 2025 (GLOBE NEWSWIRE) -- Diamond Lake Minerals, Inc. (OTC: DLMI), a multi-strategy operating company focused on digital assets and SEC-registered security tokens, today announced the formation of its Advanced Materials & IP Division (AMIPD)-a wholly integrated division within DLMI that will spearhead the Company’s exploration into frontier intellectual property over the coming decade. AMIPD functions as a direct extension of DLMI; all IP and activity under AMIPD are wholly owned and ...

Core Insights - Ansys has announced thermal and multiphysics signoff tool certifications for designs using Intel's 18A process technology, enhancing the reliability of advanced semiconductor systems for AI, GPUs, and HPC applications [2][8] - The collaboration between Ansys and Intel Foundry includes a comprehensive multiphysics signoff analysis flow for Intel's EMIB technology, facilitating the development of multi-die 3D integrated circuit systems [2][4] Group 1: Certification and Tools - Ansys RedHawk-SC and Totem are recognized for their speed, accuracy, and capacity in analyzing power integrity and reliability of Intel's 18A RibbonFET GAA transistors with PowerVia backside power delivery [3][8] - HFSS-IC Pro, a new addition to the HFSS-IC product family, is introduced for scalable electromagnetic analysis, certified for on-chip electromagnetic integrity in various telecommunication applications [3][8] - The qualification process for RedHawk-SC, Totem, and HFSS-IC Pro is ongoing for the Intel 18A high-performance process node, with customers able to request the latest Intel PDK for early design work [5][8] Group 2: Collaboration and Ecosystem - Ansys is joining the Intel Foundry Chiplet Alliance to develop a secure ecosystem for designing and manufacturing interoperable chiplets, enhancing multi-die assembly efficiency [6][7] - The collaboration aims to advance chiplet technology and improve the performance and integration of advanced computing systems through the EMIB-T technology, which will include through-silicon vias [4][7] - Ansys emphasizes the importance of precise tools for ensuring reliability in semiconductor systems, reinforcing its commitment to providing open-source and interoperable technology [7][8]