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利扬芯片:拟向特定对象增发募资不超过9.7亿元
Mei Ri Jing Ji Xin Wen· 2026-01-30 12:03
Group 1 - The company Liyang Chip announced on January 30 that its plan for a private placement of shares has been approved by the board of directors, allowing for the issuance to no more than 35 specific investors [1] - The total number of shares to be issued will not exceed 20% of the company's total share capital prior to the issuance, amounting to approximately 40.69 million shares [1] - The issuance price will be no less than 80% of the average trading price of the company's shares over the 20 trading days prior to the pricing benchmark [1] Group 2 - The company aims to raise no more than 970 million yuan, with the funds allocated for various projects including a testing project for integrated circuits, advanced packaging technology research, and a laser cutting project [1] - The total investment for the integrated circuit testing project is approximately 1.315 billion yuan, with 700 million yuan planned to be funded from the raised capital [1] - Other allocations include 100 million yuan for advanced packaging technology research, 80 million yuan for the laser cutting project, and 90 million yuan for working capital and bank loan repayment [1]