Core Viewpoint - A research team led by Professor Yang Ronggui from Peking University has developed a scalable multi-level ordered perforated copper mesh that exhibits superior heat dissipation capabilities compared to existing solutions, as published in the journal "Cell Reports Physical Science" [1][2]. Group 1: Innovation and Technology - The team introduced a novel multi-level ordered perforated (HOP) structure that enhances the efficiency of liquid film boiling through a three-step process involving the creation of a perforated array on copper mesh, bonding it with a copper substrate, and etching to form micro-pore structures [2]. - The HOP structure significantly improves capillary transport and bubble nucleation, allowing for faster and more efficient heat dissipation, setting a new passive thermal management record in a 5×5 mm heating area [2]. Group 2: Industrial Application and Potential - The copper mesh developed by the team is commercially available on e-commerce platforms and utilizes widely adopted laser perforation technology, indicating low production difficulty and cost, with substantial industrialization potential [2].