高阶PCB/载板镀铜
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三孚新科业绩会:3D复合铜箔制备技术等领域取得进展
Zheng Quan Shi Bao Wang· 2025-09-23 09:58
Core Viewpoint - Sanfu New Technology (688268) reported a significant decline in revenue and an increase in net loss for the first half of 2025, attributed to market changes and challenges in business transformation [1] Financial Performance - The company's revenue for the first half of 2025 was 227 million yuan, a year-on-year decrease of 23.3% [1] - The net profit attributable to shareholders was a loss of 22.31 million yuan, with the loss amount expanding year-on-year [1] - Operating cash flow net amount was 10.84 million yuan, showing a year-on-year increase of 136.9% [1] Business Overview - Sanfu New Technology specializes in surface engineering chemicals and equipment, focusing on research and development of new environmentally friendly surface engineering products [1] - The company has become one of the few domestic providers offering comprehensive solutions for specialized chemicals and equipment in the PCB and new energy sectors [1] Market Challenges - The decline in performance is primarily due to changes in the market environment, cyclical adjustments in the downstream copper foil industry, and underperformance in new business expansion [1] - A significant drop in revenue from equipment components led to a notable decrease in gross profit from equipment sales [1] - The company is facing transitional challenges due to business upgrades, contributing to performance fluctuations [1] R&D and Innovation - The company has launched a series of new environmentally friendly surface engineering chemicals with independent intellectual property rights, addressing industry and customer environmental requirements [2] - Recent advancements include the development of 3D composite copper foil preparation technology, enhancing battery performance and safety, with products currently in testing with leading battery manufacturers [3] - The company is also iterating on high-density PCB/circuit board copper plating technology to meet the increasing demand for high-performance PCBs, particularly for AI server boards [3]