Core Points - Hyundai Mobis has achieved the highest grade of ISO 26262 certification for its entire vehicle semiconductor R&D process, indicating a commitment to functional safety in automotive systems [1][3][4] - The certification ensures that future semiconductors designed through this standardized R&D process will have the same reliability as certified products, enhancing the company's competitiveness in the automotive semiconductor market [2][6] - Hyundai Mobis plans to share its certification achievements and know-how with partners to foster the domestic automotive semiconductor ecosystem [2][10] Certification Details - The ISO 26262: 2018 2nd edition certification was awarded by Exida, a recognized certification agency in automotive functional safety and cybersecurity [3] - Hyundai Mobis received the highest D grade in the Automotive Safety Integrity Level (ASIL), which requires a reliability of 99% or higher to prevent safety accidents [4] Production and Development - The company is set to mass-produce 16 types of semiconductors, totaling 20 million units this year, which is expected to improve its competitiveness in core components [6][8] - Hyundai Mobis is also accelerating R&D for 11 next-generation semiconductors, including those for battery management systems and communication, with a completion goal within three years [9] Strategic Partnerships - The company is enhancing collaboration with major domestic semiconductor firms and has established joint labs to drive innovation in smart ambient lighting and integrated drive semiconductors [12][13] - Hyundai Mobis aims to strengthen partnerships with foundry companies and design houses to optimize processes and expand its semiconductor ecosystem [13]