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黄仁勋:下一代AI芯片Rubin需求“极其强劲”!科创芯片设计ETF天弘(589070)标的指数盘中拉升3%
Ge Long Hui A P P· 2026-01-30 05:11
①阿里平头哥上线自研高端AI芯片"真武810E",性能对标英伟达H20。知情人士透露,阿里正考虑将未 来三年投入到AI基建与云计算上的3800亿元提升至4800亿元。 格隆汇1月30日|今日上午,半导体板块盘中拉升,成份股普冉股份、中微半导、芯原股份分别涨 9.88%、9.21%和6.97%,带动科创芯片设计ETF天弘(589070)标的指数上演V型拉升,从早盘深跌2%翻 红上涨1%,盘中振幅高达3%,该ETF上个交易日大幅"吸金"超6200万元。 科创芯片设计ETF天弘(589070)专注产业"大脑"环节,芯片设计行业占比96%,涵盖 CPU、GPU、AI 芯 片、存储芯片、模拟芯片等,完整覆盖芯片设计产业链,前十大成分股涵盖寒武纪(AI训练芯片)、海光 信息(通用计算芯片)、澜起科技(内存接口芯片)、芯原股份(IP核)等AI算力体系核心企业,直接受益AI算 力爆发。 消息面上: ②黄仁勋透露下一代AI芯片Rubin需求"极其强劲",正携手英特尔开发定制X86处理器,今年预增大幅 增长。他还警示,台积电未来十年产能扩充将面临严峻的能源挑战。 国信证券指出,受AI增量需求拉动,电子上游涨价品类不断增加,存储和 ...
阿里真武PPU累计出货量达数十万片,科创芯片ETF(588200)一键布局国产芯片投资机遇
Xin Lang Cai Jing· 2026-01-30 05:11
2026年1月30日早盘,芯片板块盘中震荡,截至11:14,上证科创板芯片指数上涨0.50%,成分股仕佳光 子上涨7.31%,芯原股份上涨5.38%,华峰测控上涨3.95%,澜起科技上涨2.65%,联芸科技上涨2.60%。 科创芯片ETF(588200)跟踪上证科创板芯片指数,是布局科创板芯片板块的便利工具。 没有股票账户的场外投资者可以通过科创芯片ETF联接基金(017470)关注国产芯片投资机遇。 数据显示,截至2025年12月31日,上证科创板芯片指数前十大权重股分别为中芯国际、海光信息、寒武 纪、澜起科技、中微公司、拓荆科技、芯原股份、华虹公司、沪硅产业、东芯股份,前十大权重股合计 占比57.76%。 消息方面,阿里明确"云+AI+芯片"战略,平头哥真武PPU累计出货量已达数十万片,在国产GPU厂商中 属于第一梯队。此外,Wind数据显示,截至1月29日17时,近250家科创板公司"透底"2025年业绩相关 情况,其中125家公司预计实现盈利,占比约五成。从归母净利润增幅看,67家公司同比预计实现正增 长(剔除扭亏),其中29家公司业绩实现倍增。从细分行业和属性来看,受益于市场需求复苏、主业提 质增效 ...
还在涨!存储、TDK、ST等热门芯片料号鉴定
芯世相· 2026-01-30 04:23
我是芯片超人花姐,入行20年,有50W+芯片行业粉丝。 有很多不方便公开发公众号的, 关于芯片买卖、关于资 源链接等, 我会分享在朋友圈 。 扫码加我本人微信 1月,现货市场上的存储 在开年之后都更火了,价格也在走高,同时运动传感器的热度有增不减。 我们筛选了一些本月热度上涨的芯片,供大家参考 (不作为 交易 推荐) : 1.火上加火的NOR Flash 「 W25Q128JV / W25Q64JV 」 2.价格暴涨的 运动跟踪器 「 ICM-42688-P / ICM-42670-P 」 3.风口上 的DDR3 「 MT41K256M16TW-107:P 」 4.贵价DDR5 「 H5CG48AGBDX018N 」 5.一直火热的eMMC 「 KLM8G1GETF-B041 」 6.NOR Flash全球第二 「 GD25Q128ESIGR 」 7.ST MEMS加速度计 「 LIS3DHTR 」 NO.1 火上 加火的NOR Flash W25Q128JV / W 25Q64JV: 继续涨价 1月W25Q128JVSIQ 和 W25Q64JVSSIQ热度继续蹿升 , 市场上求购和出货都很多 。 W25Q1 ...
上海存储芯片“小巨人”冲刺港交所,年入10亿,市值275亿
3 6 Ke· 2026-01-30 04:07
芯东西1月30日报道,1月26日,上海高性能非易失性存储(NVM)芯片设计公司聚辰股份正式递表港交所。 聚辰股份成立于2009年11月,致力于满足AI时代高速迭代与扩容的存储需求,研发及供应SPD芯片、EEPROM、NORFlash等关键存储类芯 片、摄像头马达驱动芯片等混合信号类芯片以及NFC芯片及配套解决方案,并持续推进VPD芯片的认证工作。 同时,该公司正在推动闭环式及光学防抖式摄像头马达驱动芯片等高端产品的规模化量产交付,并逐步切入边缘AI等快速增长的新兴市场。 其产品组合现已覆盖AI基础设施、汽车电子、工业控制、消费电子等存储应用场景,已得到全球内存模组巨头、中国及境外知名汽车企业、 主流智能手机厂商等下游终端客户的广泛应用。 根据弗若斯特沙利文的资料,按2023年及2024年收入计,聚辰股份是全球第三、中国第一大EEPROM供应商,以及全球第二大DDR5 SPD芯 片供应商。 全球能够大规模提供配套DDR5存储器模组的SPD芯片供应商仅有2家。按2024年收入计,聚辰股份拥有全球DDR5 SPD芯片市场超过40%的份 额,且拥有全球EEPROM市场14.0%的份额。 在开环摄像头马达驱动芯片市场中 ...
Gold, Silver and US stock markets see massive volatility as markets swing nearly $9 trillion
BusinessLine· 2026-01-30 04:06
Market Volatility - US financial markets experienced extreme volatility, with an estimated $9 trillion movement in market capitalisation within a few hours, indicating heightened uncertainty across asset classes [1][2] - Gold prices initially fell by approximately 8% but recovered swiftly, reflecting intense intraday trading activity [2][5] - Silver prices dropped by 11.9% amid a slump in major US AI and technology stocks, highlighting the interconnectedness of precious metals and tech equities [5][6] Gold and Silver Price Movements - Gold prices saw a significant decline, erasing almost $3 trillion in value as US markets opened, before recovering close to $2 trillion by market close [2][3] - Silver initially wiped out around $750 billion but later added back nearly $500 billion, showcasing its volatility [3] - Gold peaked just below $5,600 before experiencing a sharp decline, while silver peaked above $121 per troy ounce, marking its strongest monthly gain outside December 1979 [5][6] Impact on US Equities - The S&P 500 erased $780 billion in intraday trading but recovered $530 billion by the close, reflecting the overall market volatility [3] - The Nasdaq dropped around 2.4% initially, with a wipeout of $760 billion before recovering $580 billion by the end of the session [3] - Combined US equities erased $1.15 trillion intraday and recovered $1.07 trillion by the close, indicating significant market fluctuations [3]
环球问策|进迭时空陈志坚:让有限算力发挥最大效用,AI CPU 是智能硬件的必然选择
Huan Qiu Wang· 2026-01-30 04:02
随着人工智能突飞猛进的发展,即便是普通人也可以随口甩出大模型、DeepSeek等大词的当下,对于 内行人而言,算力应是他们抵达大模型前必须面对的现实。然而,这些满怀信心投身人工智能领域的玩 家面对的现实并不是惊喜,反而更多的是"惊吓"从去年年中起,包括三星、美光、SK海力士在内的全 球主要存储芯片厂商纷纷以产能短缺宣布涨价,涨价幅度超过200%。即便如此,英伟达、AMD的算力 芯片依然"一芯难求"。 "让有限的算力发挥最大的效用!"这句箴言成为业界不言自明的共识。就在当英伟达、谷歌等巨头纷纷 向 GPU、TPU 领域布局,抢占数据中心算力赛道,一些芯片企业开始探索更具有针对性芯片。1月29 日,进迭时空举办 "K3 新品发布会",正式推出符合 RVA23 规范的 RISC-V 高性能 AI CPU 芯片。会议 前夕,进迭时空CEO陈志坚接受环球网采访,从算力进化的视角,解读了进迭时空为何在GPU备受关注 之时,却选择深耕 CPU 领域,以 AI CPU 的创新形态撬动算力革命的新可能以及对行业未来的深刻洞 察。 "进迭时空并非深耕传统形态的 CPU,而是致力于 CPU 的智能化升级,打造 AI CPU 这一创 ...
Chinese RISC-V Chipmaker SpacemiT Launches K3 AI CPU, Highlighting the Rise of Open-Source Hardware in Intelligent Computing
Globenewswire· 2026-01-30 04:00
Core Viewpoint - The launch of SpacemiT's K3 AI CPU marks a significant step in the shift towards open architectures and on-device AI computing, aiming to provide a flexible and cost-effective platform for intelligent terminals and edge computing [1][15]. Company Overview - SpacemiT, founded in 2021 and headquartered in Hangzhou, is one of the few Chinese semiconductor companies focused on a "pure RISC-V" strategy, integrating high-performance general computing and AI acceleration into a single chip [4]. - The company emphasizes a "full-stack RISC-V" strategy, covering CPU IP, chip design, operating systems, compilers, AI software stacks, and developer platforms [11]. Product Details - The K3 AI CPU, developed over 1,200 days, is among the first mass-production-ready RISC-V AI CPUs compliant with the RVA23 specification, featuring eight high-performance X100 RISC-V CPU cores with a maximum frequency of 2.4GHz [5]. - K3 delivers up to 60 TOPS of AI compute and supports up to 32GB of LPDDR5 memory, designed for local execution of medium-scale AI models and multimodal applications [6]. - The chip supports models in the 30- to 80-billion-parameter range, with typical system power consumption between 15 and 25 watts [6]. Software and Ecosystem - K3 adopts a co-design approach between hardware and software, supporting mainstream AI frameworks and compilers, and is compatible with major open-source AI ecosystems and Linux distributions [8]. - The company aims to reduce development barriers for deploying AI models on RISC-V platforms, making the experience comparable to x86 and Arm systems [8]. Market Position and Strategy - The company does not aim to compete directly with high-end server CPUs or GPUs but focuses on establishing differentiated advantages in the mid-range computing segment through lower power consumption and higher integration [14]. - SpacemiT's previous-generation K1 chip has achieved shipments of over 150,000 units, providing a foundation for the rollout of K3 [10]. Industry Context - Hangzhou is emerging as a major hub for AI, semiconductor, and open-source technology innovation in China, with SpacemiT recognized as a key player in this ecosystem [12]. - The industry acknowledges that RISC-V still lags behind x86 and Arm in high-end computing and software ecosystem maturity [13].
【IPO追踪】爱芯元智招股,冲刺“中国边缘AI芯片第一股”
Sou Hu Cai Jing· 2026-01-30 03:51
爱芯元智是人工智能推理系统芯片("SoC")的供应商,专注为边缘计算与终端设备AI应用打造高性能感知与计算平台。 随着AI产业热潮的持续,阿里巴巴-W(09988.HK)、智谱(02513.HK)等AI概念股获得了资本市场的广泛青睐。 而根据最新消息,又有一家AI芯片相关的企业——爱芯元智(00600.HK)开启了招股,即将登陆港股市场。 具体来看,此次爱芯元智拟全球发售1.05亿股H股,采用B机制发行。其中,香港公开发售1049.16万股(可予重新分配),占约10%;国际发售约9442.36万 股,占约90%;另有15%的超额配股权。 发售价为28.20港元/股,以该发行价计算,假设超额配股权未获行使,预期募集资金净额约为27.90亿港元。其中,约60%将用于优化现有技术平台及推出新 产品;约15%用于未来四年投资研发项目;约5%用于未来四年的销售扩张;约10%用于股权投资或收购以整合上下游行业资源;剩余约10%用作营运资金及 其他一般公司用途。 爱芯元智的招股期为2026年1月30日至2月5日,预期将于2月10日正式挂牌上市,每手100股,入场费为2848.44港元。 | 目大華社 申請認購的 | | 申 ...
2025年中国集成电路产量为4842.8亿块 累计增长10.9%
Chan Ye Xin Xi Wang· 2026-01-30 03:45
2020-2025年中国集成电路产量统计图 上市企业:纳思达(002180),韦尔股份(603501),江波龙(301308),士兰微(600460),华润微 (688396),佰维存储(688525),兆易创新(603986),航锦科技(000818),海光信息(688041),晶晨 股份(688099) 相关报告:智研咨询发布的《2026-2032年中国半导体集成电路产业竞争现状及发展前景规划报告》 根据国家统计局数据显示:2025年12月中国集成电路产量为481亿块,同比增长12.9%;2025年1-12月中 国集成电路累计产量为4842.8亿块,累计增长10.9%。 数据来源:国家统计局,智研咨询整理 知前沿,问智研。智研咨询是中国一流产业咨询机构,十数年持续深耕产业研究领域,提供深度产业研 究报告、商业计划书、可行性研究报告及定制服务等一站式产业咨询服务。专业的角度、品质化的服 务、敏锐的市场洞察力,专注于提供完善的产业解决方案,为您的投资决策赋能。 ...
近百亿加注国产芯 | 半导体亿元级融资全解析
是说芯语· 2026-01-30 03:44
Core Viewpoint - The Chinese semiconductor industry has experienced a financing boom in the past six months (August 2025 - January 2026), with capital focusing on key segments such as inference GPUs, AI chips, server chips, advanced packaging, and wide bandgap semiconductors [1]. Financing Events Overview Over 2 Billion RMB Financing Events - **Sunrise**: Completed approximately 3 billion RMB in strategic financing, focusing on inference GPUs, with plans for next-generation GPU development and ecosystem building [1]. 1-2 Billion RMB Financing Events - **Aixin Yuanzhi**: Secured over 1 billion RMB in C-round financing, with a post-investment valuation of 10.6 billion RMB, aiming to become the "first stock of China's edge AI chips" [3]. - **Borui Jingxin**: Received over 1 billion RMB in financing, focusing on ARM server chips and digital solutions for various industries [4]. 500 Million to 1 Billion RMB Financing Events - **Heizhima Intelligent**: Obtained 500 million RMB in strategic investment, focusing on edge AI and embodied intelligence [5][6]. - **Jindishi Technology**: Completed over 600 million RMB in B-round financing, focusing on RISC-V AI chips [7]. - **Zhizhan Technology**: Secured nearly 300 million RMB in C-round financing, focusing on silicon carbide power semiconductor devices [8]. - **Mingjia Semiconductor**: Completed 110 million RMB in A++ round financing, focusing on gallium oxide semiconductors [9]. - **Xiqian Semiconductor**: Achieved over 1 billion RMB in strategic financing, focusing on silicon-based capacitors and related technologies [11]. - **Xulun Technology**: Completed over 1 billion RMB in A3 and A4 round financing, focusing on advanced packaging materials [12]. - **Lanxin Computing Power**: Secured over 1 billion RMB in A-round financing, focusing on RISC-V architecture intelligent computing chips [13]. - **Liangxuan Technology**: Completed several hundred million RMB in C-round financing, focusing on quantum computing [14]. - **Ruishi Technology**: Achieved several hundred million RMB in C-round financing, focusing on semiconductor optical chips [15]. Financing Characteristics - Capital is concentrated in high-end chips and advanced materials, addressing critical areas such as inference GPUs and ARM server chips, while also covering wide bandgap semiconductors and advanced packaging materials [16]. - The financing scale is clear, with leading companies like Sunrise and Aixin Yuanzhi securing over 1 billion RMB, while over 70% of smaller "specialized and innovative" companies received financing in the 100 million RMB range [16]. - Local state-owned platforms and industrial funds are key investors, focusing on both financial returns and the improvement of the industrial chain [16]. - The financing companies align with the distribution of semiconductor industry clusters, with major cities like Beijing, Shanghai, and Shenzhen leading, while emerging cities like Chengdu are also gaining traction [16].