Core Insights - The release of Xpeedic EDA 2025 software suite by Xinheng Semiconductor includes three core platforms: Chiplet advanced packaging design platform, packaging/PCB full-process design platform, and integrated system simulation platform [1] - The founder and president of Xinheng Semiconductor, Dr. Dai Wenliang, emphasized that the software aims not only for domestic use but also to compete in the international market [1] - The semiconductor industry is undergoing a comprehensive transformation driven by the implementation of the State Council's "Artificial Intelligence +" initiative, with a surge in demand for AI large model training and the need for advanced packaging solutions due to the slowdown of Moore's Law [1] Industry Trends - The integration of EDA and AI is highlighted as a significant industry trend, with the company leveraging 15 years of experience to enhance cross-scale simulation efficiency and support large-scale system-level optimization [2] - The domestic semiconductor industry's development is characterized by using mathematical models to compensate for physical limitations, reducing the need for physical prototype validation through numerical simulations [2] - Advanced packaging techniques, such as heterogeneous integration and Chiplet, are being utilized to address cost and yield issues associated with advanced processes, while innovative computing architectures are being developed to overcome performance ceilings of process nodes [2]