Core Insights - KIOXIA America, Inc. has begun shipping evaluation samples of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC [1][2] - UFS 5.0 is designed for high-end mobile devices, supporting speeds up to 46.6 Gigabits per second (Gb/s) per lane, achieving approximately 10.8 Gigabytes per second (GB/s) of effective read/write performance [1][2] - The evaluation samples feature a new in-house controller and KIOXIA BiCS FLASH generation 8 3D flash memory, available in capacities of 512 GB and 1 TB [2][3] Product Specifications - UFS 5.0 utilizes MIPI M-PHY version 6.0 and UniPro version 3.0, with the new HS-GEAR6 mode introduced for enhanced performance [1] - The redesigned package measures 7.5 x 13 mm, improving board space efficiency and design flexibility [2] - Shipments of 512 GB evaluation samples began on February 24, with 1 TB samples scheduled to start in March [7] Market Positioning - KIOXIA aims to accelerate the development of future-ready smartphones by providing high-speed, high-capacity solutions for advanced on-device AI applications [3] - The company continues to innovate in embedded flash memory technology to meet the growing demands for larger capacity and higher performance in the mobile market [3][5]