Core Insights - Ansys has announced thermal and multiphysics signoff tool certifications for designs using Intel's 18A process technology, enhancing the reliability of advanced semiconductor systems for AI, GPUs, and HPC applications [2][8] - The collaboration between Ansys and Intel Foundry includes a comprehensive multiphysics signoff analysis flow for Intel's EMIB technology, facilitating the development of multi-die 3D integrated circuit systems [2][4] Group 1: Certification and Tools - Ansys RedHawk-SC and Totem are recognized for their speed, accuracy, and capacity in analyzing power integrity and reliability of Intel's 18A RibbonFET GAA transistors with PowerVia backside power delivery [3][8] - HFSS-IC Pro, a new addition to the HFSS-IC product family, is introduced for scalable electromagnetic analysis, certified for on-chip electromagnetic integrity in various telecommunication applications [3][8] - The qualification process for RedHawk-SC, Totem, and HFSS-IC Pro is ongoing for the Intel 18A high-performance process node, with customers able to request the latest Intel PDK for early design work [5][8] Group 2: Collaboration and Ecosystem - Ansys is joining the Intel Foundry Chiplet Alliance to develop a secure ecosystem for designing and manufacturing interoperable chiplets, enhancing multi-die assembly efficiency [6][7] - The collaboration aims to advance chiplet technology and improve the performance and integration of advanced computing systems through the EMIB-T technology, which will include through-silicon vias [4][7] - Ansys emphasizes the importance of precise tools for ensuring reliability in semiconductor systems, reinforcing its commitment to providing open-source and interoperable technology [7][8]