Core Viewpoint - Debang Technology has announced a change in its fundraising project, reallocating the remaining funds of 62.3699 million yuan from the "Annual Production of 35 Tons of Semiconductor Electronic Packaging Materials Project" to a new project focused on the "Debang Semiconductor Material R&D and Production Base in South China" to align with industry trends and optimize strategic layout [2][4]. Group 1 - The new project will be implemented by Debang Technology's wholly-owned subsidiary, Shenzhen Debang Interface Materials Co., Ltd., located in Longgang District, Shenzhen, with a construction period of 2 years and a total investment of 230 million yuan [2]. - The new project aims to achieve an annual production capacity of 450 tons of thermal management and EMI materials, including subcategories such as thermal paste, thermal mud, thermal gel, thermal pads, phase change materials, and conductive adhesives, focusing on the core semiconductor materials sector [3]. - The original project, which has been terminated, was planned to produce 15 tons of electronic packaging materials for semiconductor chips and systems, and 20 tons of photovoltaic stacking materials, but faced significant delays and low funding utilization [3]. Group 2 - The change in fundraising projects reflects Debang Technology's quick response to changes in industry demand and is a strategic move to optimize regional production capacity and strengthen core competitiveness, potentially injecting new momentum into the company's development in the high-end semiconductor materials sector [4].