Core Viewpoint - Intel may be closer to surpassing TSMC than previously anticipated, particularly through the accelerated implementation of high-NA EUV lithography technology, which could significantly alter the semiconductor industry landscape [1][3][19]. Group 1: Intel's Technological Advancements - Intel's turnaround began in 2021 with the appointment of former CEO Pat Gelsinger, and recent developments suggest that the company may be progressing faster than analysts expect [2]. - High-NA EUV lithography technology, which allows for more precise chip patterning, could enable Intel to leapfrog TSMC if implemented sooner than planned [3][6]. - Intel has already acquired and utilized at least three high-NA machines, indicating readiness to integrate this technology into its manufacturing processes [10][11]. Group 2: Competitive Landscape - Historically, Intel's delay in adopting EUV technology allowed TSMC to gain a significant manufacturing lead, which it has maintained [5]. - TSMC has opted to delay the use of high-NA EUV technology due to cost concerns, while Intel has positioned itself to be the first to implement it [7]. - Intel's extensive experience with high-NA tools and the reported advantages in productivity could provide a competitive edge over TSMC [8][19]. Group 3: Production and Implementation - Intel has achieved "acceptance testing" of its high-NA machines, indicating they meet manufacturing benchmarks and specifications [12]. - The company is processing 30,000 wafers per quarter using high-NA tools, suggesting significant operational capacity [18]. - Speculation exists that Intel may be testing high-NA technology on its 18A manufacturing process, although the company has not confirmed this [20][21]. Group 4: Future Prospects - Intel's decision to point to 14A as the first node for high-NA EUV raises questions, especially given its substantial investment in high-NA machines [17][18]. - The potential for high-NA tools to be used in the 18A process remains uncertain, with indications that it may only be applied to certain layers of chips [25][27]. - The upcoming CES in Las Vegas could provide an opportunity for Intel to disclose its advancements in the 18A process, particularly with the unveiling of its first 18A-produced chip [28].