Core Insights - Axcelis Technologies, Inc. will sponsor the Advanced Semiconductor Manufacturing Conference (ASMC) from May 5-8, 2025, in Albany, New York, focusing on innovative strategies to address manufacturing challenges in the semiconductor industry [1] Group 1: Event Participation - Axcelis will present a session on "Contamination Free Manufacturing" on May 6, 2025, highlighting a case study on reducing particle contamination during low-energy boron implantation [2] - The presentation will be led by Dr. Phillip Geissbuhler, Staff Scientist at Axcelis, along with coauthors from both Axcelis and SK Hynix [2] Group 2: Technical Focus - The case study discusses new hardware implementation that reduces boron film buildup on beamline components, which is crucial for maintaining device yield by preventing particle contamination [2] - The new hardware enhances the ion beam angle of incidence, leading to improved self-sputtering of films and a significant reduction in film growth rate on surfaces near the wafer [2] Group 3: Company Background - Axcelis has over 45 years of experience in providing high-productivity solutions for the semiconductor industry, focusing on ion implantation systems, a critical step in integrated circuit manufacturing [3] - The company emphasizes its technical expertise in contamination control, developed through collaboration with leading device manufacturers [3]