Core Viewpoint - The increasing integration, signal frequency, and compactness in high-end manufacturing sectors such as electronics, communications, and new energy vehicles raise the risk of electromagnetic interference (EMI), necessitating higher requirements for circuit design [1] Group 1: EMI Challenges and Solutions - EMI can lead to signal distortion, delay, or loss, and prolonged exposure may accelerate component aging or cause permanent damage [1] - To address the challenges of electromagnetic compatibility (EMC) and bonding in high-frequency, high-speed, and lightweight electronic devices, the company has launched an EM product series that includes conductive tapes and absorbing materials [1] Group 2: Conductive Tapes - Conductive tapes create conductive pathways through internal conductive fillers, allowing current to pass between materials, dispersing static electricity, and providing grounding functions to protect sensitive components [3] - The double-sided conductive non-woven tape features low impedance and high conductivity, suitable for curved surfaces, and is designed for applications in antennas, FPC, and PCB grounding [4] - The printed black conductive fabric tape offers low impedance, high conductivity, and temperature resistance, primarily used for edge wrapping of display modules, cable winding, and shielding [5] Group 3: Conductive Adhesives and Absorbing Materials - The conductive thermosetting adhesive film is made from modified epoxy resin and conductive powder, requiring heat activation for adhesion, and is suitable for high-strength applications like FPC reinforcement and small structural components [6] - The absorbing material, a flexible composite of soft magnetic alloy powder and polymer, effectively absorbs EMI and is suitable for various electronic components, enhancing system EMC performance [7] - The company’s four functional materials work synergistically to create a comprehensive EMI protection system, providing an overall solution from materials to performance, thus supporting higher reliability and better signal integrity in electronic manufacturing [7]