塑料挤出成型装备
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耐科装备:公司主要产品为半导体全自动封装装备和塑料挤出成型装备
Zheng Quan Ri Bao Wang· 2025-11-20 10:47
Core Viewpoint - The company, NAIKE Equipment, is making progress in the semiconductor packaging equipment sector, with its products gradually closing the gap with international leading brands while increasing its domestic market share [1] Group 1: Company Overview - NAIKE Equipment's main products include fully automatic semiconductor packaging equipment and plastic extrusion molding equipment [1] - In the semiconductor packaging equipment field, some technical indicators have reached international advanced levels, although there is still a gap overall [1] Group 2: Market Position - The company is continuously conducting research and development to narrow the gap between its fully automatic semiconductor packaging equipment and similar products from top international brands [1] - The domestic market coverage rate of the company's products is increasing year by year [1]