Core Insights - The article highlights the procurement intentions of the Shanghai Institute of Microsystem and Information Technology, which plans to purchase 16 types of instruments with a total budget of 112 million yuan [1][2]. Procurement Summary - The procurement includes various advanced systems such as: - Large warp photoresist coating and developing system: 7.5 million yuan, scheduled for June 2025 [4] - Large warp adhesive film removal system module: 6.62 million yuan, scheduled for June 2025 [4] - Multi-material bubble removal system module: 1.23 million yuan, scheduled for June 2025 [4] - Multi-functional etching system module: 27.5 million yuan, scheduled for June 2025 [4] - Optical coupling integration module: 1.4 million yuan, scheduled for June 2025 [4] - Ultra-high precision microwave driving module: 2.5 million yuan, scheduled for June 2025 [4] - Ultra-high frequency device analysis module: 3 million yuan, scheduled for June 2025 [4] - Superconducting thin film modification ion implanter: 10 million yuan, scheduled for April 2025 [4] - Automatic wafer slicing machine: 1.5 million yuan, scheduled for April 2025 [4] - Wafer-level packaging machine: 5 million yuan, scheduled for April 2025 [4] - Wafer edge cutting machine: 1 million yuan, scheduled for April 2025 [4] - Wafer temporary bonding machine: 7 million yuan, scheduled for April 2025 [4] - High stability microwave monitoring module: 1.5 million yuan, scheduled for June 2025 [4] - PVD preparation functional module for piezoelectric thin film materials: 29.81 million yuan, scheduled for June 2025 [4] - RCA cleaning, brushing, and mixed liquid combination module: 2 million yuan, scheduled for June 2025 [4]