Core Viewpoint - Liyang Chip announced a plan to raise a total of up to 970 million yuan through a private placement of shares, with the funds allocated for various projects and operational needs [1] Fundraising Purpose - The raised funds will be used for the following projects: - Integrated circuit testing project at Dongcheng Liyang Chip - Wafer laser dicing project (Phase I) - Advanced packaging technology research and development for heterogeneous stacking - Supplementing working capital - Repaying bank loans [1] Fund Utilization - Before the funds are in place, the company can invest its own or self-raised funds based on the actual situation of the investment projects, and will replace these with the raised funds once they are available, in accordance with relevant laws and regulations [1]