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晶晨半导体,拟港股IPO
Core Viewpoint - Company plans to list H-shares on the Hong Kong Stock Exchange to enhance capital strength and competitiveness, following its listing on the Shanghai Stock Exchange in August 2019 [1] Group 1: Fundraising and Business Overview - The funds raised will primarily be used to enhance R&D capabilities, build a global customer service system, and support strategic investments and acquisitions related to the "platform + ecosystem" strategy [3] - Company is a leading global system-level semiconductor design manufacturer, providing smart terminal control and connectivity solutions across various sectors, including smart homes and automotive [2] - As of June 30, the company has shipped over 1 billion chips, with projections indicating that by 2024, one in three smart set-top boxes and one in five smart TVs will use its chips [2] Group 2: Financial Performance - Revenue figures for the company are projected as follows: approximately 5.545 billion yuan in 2022, 5.371 billion yuan in 2023, 5.926 billion yuan in 2024, and 3.33 billion yuan in the first half of 2025, with corresponding net profits of about 732 million yuan, 499 million yuan, 819 million yuan, and 493 million yuan [2] Group 3: Customer and Supplier Dependency - The top five customers contributed approximately 3.21 billion yuan, 3.519 billion yuan, 3.752 billion yuan, and 2.207 billion yuan to total revenue in 2022, 2023, 2024, and the first half of 2025, representing 57.9%, 65.5%, 63.3%, and 66.3% of total revenue respectively [4] - The company has a high dependency on suppliers, with the top five suppliers accounting for 91.2%, 86.6%, 88.0%, and 78.9% of total procurement in the same years [4]