Group 1: Business Progress and Innovations - The company has developed a series of laser devices for PCB/FPC high-precision processing, replacing traditional mechanical methods, with expected annual orders exceeding 90 million yuan [1][2] - The ultra-fast laser drilling equipment can achieve stable processing of micro-hole diameters between 30-70µm, with a drilling efficiency of up to 10,000 holes per second, and the first batch of samples has been well received by customers [2][3] - The company is actively pursuing opportunities in the M9 material drilling process with its self-developed ultra-fast laser drilling equipment [3] Group 2: Product Development and Market Strategy - The company focuses on "new products, new materials, new processes" to capture structural growth opportunities, developing laser solutions for various materials and components, with clients including AAC Technologies, Lens Technology, and GoerTek [4] - The laser device's core component, the laser, is crucial for enhancing penetration rates and is a key competitive advantage for the company, which continues to lead the industry in 2025 [5][6] - The company is committed to strengthening its laser technology leadership by developing more advanced products based on existing advantages in short pulse, continuous pulse, short wavelength, and high power [5]

Core Insights - The company, Innolaser, announced on November 10 that it is addressing the high craftsmanship demands in industries such as consumer electronics, semiconductors, and computing power by replacing traditional mechanical processing methods with solid-state nanosecond and ultrafast laser technologies [1] Group 1: Technology and Product Development - Innolaser has developed a series of lasers and laser equipment applicable for cutting, drilling, and window opening processes [1] - The laser high-speed splitting equipment has replaced milling cutters, providing a processing method that is low-loss, high-precision, high-efficiency, and highly reliable, with mass delivery already achieved [1] - The company expects to exceed 90 million yuan in orders for the year [1] Group 2: Performance Metrics - The laser ultra-precision drilling equipment, equipped with ultrafast lasers, can achieve stable processing of micro-hole diameters ranging from 30 to 70 µm, with a drilling efficiency of up to 10,000 holes per second [1] - The initial sample results have been well received by customers [1] Group 3: Market Expansion - The laser high-speed punching equipment is capable of fulfilling drilling, splitting, and window opening needs for flexible printed circuits (FPC), and is currently undergoing process optimization and market expansion [1]