Core Insights - The company, Innolaser, announced on November 10 that it is addressing the high craftsmanship demands in industries such as consumer electronics, semiconductors, and computing power by replacing traditional mechanical processing methods with solid-state nanosecond and ultrafast laser technologies [1] Group 1: Technology and Product Development - Innolaser has developed a series of lasers and laser equipment applicable for cutting, drilling, and window opening processes [1] - The laser high-speed splitting equipment has replaced milling cutters, providing a processing method that is low-loss, high-precision, high-efficiency, and highly reliable, with mass delivery already achieved [1] - The company expects to exceed 90 million yuan in orders for the year [1] Group 2: Performance Metrics - The laser ultra-precision drilling equipment, equipped with ultrafast lasers, can achieve stable processing of micro-hole diameters ranging from 30 to 70 µm, with a drilling efficiency of up to 10,000 holes per second [1] - The initial sample results have been well received by customers [1] Group 3: Market Expansion - The laser high-speed punching equipment is capable of fulfilling drilling, splitting, and window opening needs for flexible printed circuits (FPC), and is currently undergoing process optimization and market expansion [1]