Core Viewpoint - Zhejiang Wuzhou Xinchun Group Co., Ltd. has applied for a patent for a grinding tool used in silicon carbide substrate wafer grinding, indicating its focus on innovation in manufacturing processes and materials [1][2]. Group 1: Patent Application - The patent application is titled "A Fixed Grinding Tool for Silicon Carbide Substrate Wafer Grinding and Its Preparation Method" with publication number CN120903925A, filed on July 2025 [1]. - The grinding tool is made from a mixture of raw materials including 74-91% silica abrasive, 5-10% low-density polyethylene resin binder, 3-12% potassium chlorate powder, and 1-4% manganese dioxide powder, with a specific ratio of potassium chlorate to manganese dioxide being 3:1 [1]. - The invention enhances processing efficiency and quality by producing a soft layer through a chemical reaction during grinding, while also ensuring good self-sharpening properties and stable processing performance [1]. Group 2: Company Overview - Zhejiang Wuzhou Xinchun Group Co., Ltd. was established in 1999 and is located in Shaoxing City, primarily engaged in general equipment manufacturing [2]. - The company has a registered capital of 3,662.0277 million RMB and has invested in 29 enterprises, participated in 45 bidding projects, and holds 220 patents [2]. - Additionally, the company has 17 trademark registrations and 36 administrative licenses, showcasing its active engagement in intellectual property and regulatory compliance [2].