Core Viewpoint - The company plans to issue convertible bonds to raise funds for the development of an ASIC chip testing system, with a total fundraising amount not exceeding RMB 74,947.51 million [2][3]. Group 1: Convertible Bond Details - The company intends to issue up to 7,494,751 convertible bonds, each with a face value of RMB 100, and a maturity period of six years from the date of issuance [2]. - The initial conversion price will be determined based on the average trading price of the company's stock over the twenty trading days prior to the announcement of the prospectus, adjusted for any stock splits or dividends [2]. - The specific issuance method will be determined by the board of directors and authorized personnel in consultation with the lead underwriter [3]. Group 2: Fund Utilization - The net proceeds from the bond issuance will be allocated to the research and innovation project based on the self-developed ASIC chip testing system, with a total investment amount of RMB 75,888 million [4]. - The company will prioritize the allocation of convertible bonds to existing shareholders [4]. Group 3: Regulatory and Advisory Aspects - The company will engage a credit rating agency to provide a credit rating report for the bond issuance, and the bonds will not be guaranteed [4]. - The lead underwriter for this issuance is China International Capital Corporation, with designated representatives [4].