Core Viewpoint - The semiconductor industry is facing increased demand for efficient heat dissipation solutions due to rising chip temperatures as advanced processes lead to smaller chip sizes and higher power outputs [1] Group 1: Heat Dissipation Demand - High surface temperatures in chips can lead to decreased safety and reliability, creating a significant need for effective heat dissipation solutions [1] - Diamond is identified as an ideal heat dissipation material, with a thermal conductivity of up to 2000 W/m·K, which is 4-5 times that of copper and silver, and several times that of silicon and silicon carbide [1] Group 2: Diamond's Advantages - Diamond possesses high bandgap, exceptional current carrying capacity, excellent mechanical strength, and radiation resistance, making it advantageous in high power density and high-temperature applications [1] - Applications of diamond include substrates, heat sinks, and diamond structures with microchannels, suitable for semiconductor devices and server GPUs [1] Group 3: Production and Market Potential - Chemical vapor deposition (CVD) is the mainstream method for producing single crystal, polycrystalline, and nanodiamond, with domestic and international companies developing related products [1] - With the increasing demand for computing power and the development of third-generation semiconductors, diamond has significant market potential in high-end heat dissipation [1] Group 4: Competitive Landscape - As diamond heat dissipation solutions continue to improve, they are expected to reshape the global competitive landscape of heat dissipation technology [1] - China, being a major producer of superhard materials, leads the world in synthetic diamond production, indicating a clear advantage in the industry chain and potential benefits from this trend [1]