Core Viewpoint - The demand for thermal management materials is increasing rapidly in the context of technological advancements, particularly in electronic packaging and high-power devices. Metal diamond composite materials, especially copper diamond, aluminum diamond, and silver diamond, are emerging as key players in this field [1][3][12]. Group 1: Product Overview - Copper diamond composite is made from diamond powder and copper alloy, featuring a thermal conductivity of around 600 W/m·K and a low thermal expansion coefficient, making it suitable for high-performance applications [1]. - Aluminum diamond composite is characterized by low thermal expansion, high thermal conductivity, high strength, and lightweight properties, gaining attention as a heat dissipation component for GaN semiconductor chips [1]. - Silver diamond composite exhibits an impressive thermal conductivity of up to 650 W/m·K at room temperature, significantly outperforming traditional packaging materials like CuW [2]. Group 2: Market Demand and Trends - The semiconductor industry has seen rapid growth, leading to increased demand for metal diamond composites due to their superior weight and thermal performance requirements [3]. - The global market for metal diamond composites is projected to grow from $199.20 million in 2024 to $381.43 million by 2031, with a CAGR of 10.24%. The Chinese market is expected to grow from $60.82 million to $116.83 million in the same period, with a CAGR of 10.36% [12]. - Copper diamond composites dominate the market, expected to reach $189.28 million in 2024, accounting for 95.02% of the market share, followed by aluminum diamond at $7.12 million (3.35%) and silver diamond at $3.06 million (1.54%) [12]. Group 3: Industry Challenges - Domestic companies face challenges such as insufficient R&D investment and a shortage of high-end talent, which hinder the development of the metal diamond composite industry [4]. - The supply chain for the industry is relatively underdeveloped, leading to unstable raw material supply and rising costs [5]. - The industry is also limited by inadequate diamond processing technologies, including welding, polishing, and cutting techniques, which restrict the application of diamond composites [22]. Group 4: Future Development - The application of metal diamond composites is diversifying beyond electronic cooling and aerospace thermal control, entering emerging fields such as energy storage, medical devices, and semiconductor manufacturing [6]. - Cost reduction and large-scale production are being pursued through raw material optimization, automated processes, and supply chain collaboration, with expectations of significant price drops in the next five years [7]. - Continuous optimization of interface engineering is enhancing the thermal conductivity of copper-diamond composites, with experimental thermal conductivity exceeding 800 W/m·K [8]. Group 5: Competitive Landscape - Major global players in the metal diamond composite market include Parker, ALMT Corp (Sumitomo Electric Industries), Element Six, and Youyan Technology Group, with Parker holding a market share of 16.70% in 2024 [13][26]. - The competition is expected to intensify with the entry of new players, particularly in China, where local firms can collaborate with research institutions and leverage cost advantages [13].