Core Insights - GlobalFoundries and Silicon Labs have expanded their strategic partnership to enhance the development of energy-efficient wireless technologies and bolster U.S.-based semiconductor manufacturing [1][4] - This collaboration introduces a new process technology in the U.S. aimed at accelerating the production of high-performance wireless solutions at GlobalFoundries' facility in Malta, New York [2][4] Company Developments - Silicon Labs' wireless system-on-chips (SoCs) will be produced on GlobalFoundries' new 40nm Ultra Low Power platform, which features embedded SuperFlash technology, making it suitable for IoT applications requiring energy efficiency and data security [3][4] - The partnership aims to meet the rising demand for advanced wireless connectivity in consumer and industrial IoT applications, reflecting both companies' commitment to U.S. semiconductor leadership and supply chain resilience [4][5] Market Context - The collaboration is positioned to address the growing need for secure and reliable wireless connectivity in smart consumer and industrial devices, highlighting the importance of onshore semiconductor manufacturing [4][5] - Development is currently underway, with production expected to ramp up over the next several years [5]

Core Insights - GlobalFoundries and Silicon Labs have expanded their strategic partnership to enhance the development of energy-efficient wireless technologies and bolster U.S.-based semiconductor manufacturing [1][4] - This collaboration introduces a new process technology in the U.S. aimed at accelerating the production of high-performance wireless solutions at GlobalFoundries' facility in Malta, New York [2][4] Company Developments - Silicon Labs' wireless system-on-chips (SoCs) will be produced on GlobalFoundries' new 40nm Ultra Low Power platform, which features embedded SuperFlash technology, making it suitable for IoT applications requiring energy efficiency and data security [3][4] - The partnership aims to meet the rising demand for advanced wireless connectivity in consumer and industrial IoT applications, reflecting both companies' commitment to U.S. semiconductor leadership and supply chain resilience [4] Production Timeline - Development is currently underway, with production expected to ramp up over the next several years [5]