Group 1 - The article discusses the characteristics of 5G communication technology, emphasizing the need for high-frequency electromagnetic waves to meet the increasing data transmission demands due to the development of information technology [4][5][6]. - It highlights the relationship between signal transmission loss and dielectric properties, indicating that higher communication frequencies require materials with lower dielectric constants and loss factors [7][8]. - The article outlines the requirements for circuit substrates in high-frequency communication, including low dielectric constant, high thermal conductivity, solvent resistance, and dimensional stability [10][11]. Group 2 - The preparation and performance study of fluorinated thermosetting polyphenylene ether (PPO) is presented, focusing on the effects of physical and chemical modifications on dielectric properties [12][14]. - The article details the curing behavior of PPO-Allyl-F, noting that the conversion rate of double bonds increases with curing time, indicating a first-order reaction [17][18]. - It compares the dielectric performance of various modified PPOs, showing that the dielectric constant and loss vary with the type of modification, with PPO-vinyl exhibiting lower values due to its cross-linked structure [38][39]. Group 3 - The article discusses the preparation and performance of hydrocarbon-based thermosetting polyphenylene ether, emphasizing the impact of different side groups on thermal and dielectric properties [25][26]. - It presents the curing characteristics of hydrocarbon-based PPOs, noting that the conversion rates of carbon-carbon double bonds vary significantly based on curing conditions [30][31]. - The dielectric performance of hydrocarbon-modified PPOs is analyzed, revealing that the introduction of hydrocarbon chains can slightly reduce the dielectric constant while affecting the dielectric loss [37][38]. Group 4 - The article explores the application of modified boron nitride/thermosetting polyphenylene ether composites in circuit boards, highlighting their thermal and mechanical properties [58][59]. - It details the effects of filler content on the thermal conductivity and dielectric properties of the composites, indicating that higher boron nitride content can enhance thermal performance while affecting dielectric characteristics [62][66]. - The study compares the mechanical performance of different composite formulations, noting that excessive filler can lead to reduced mechanical strength due to poor polymer-filler interaction [63][72].