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AMAT Stock Trades at a P/E of 16.69X: Should You Buy, Sell or Hold?
ZACKS· 2025-08-19 16:31
Group 1: Company Valuation and Performance - Applied Materials (AMAT) stocks are trading at a forward 12-month P/E of 16.69X, which is significantly lower than the Zacks Electronics - Semiconductors industry's P/E of 34.47X, indicating a potential discount [1][4] - Year-to-date, AMAT stock has increased by 0.5%, while the industry has seen a return of 19.7%, highlighting AMAT's underperformance [2] - AMAT shares are trading below both the 200-day and 50-day moving averages, suggesting a bearish trend in the stock [14][15] Group 2: Market Challenges - Increasing U.S.-China tensions and export restrictions on semiconductor manufacturing equipment are major headwinds for AMAT, particularly affecting sales in China, which is a crucial market for the company [5][7] - The company has experienced a sharp decline in its China business from Q4 2024 to Q2 2025, with expectations of revenue decline in Q4 due to capacity digestion in China [6] - The broader semiconductor market is recovering, but memory markets, including DRAM and NAND, remain weak, with only a gradual recovery expected in 2025, which could impact AMAT's revenue growth [8] Group 3: Competitive Landscape - AMAT faces competition from companies like KLA Corporation, Lam Research, and ASML Holdings, which are gaining traction in the semiconductor supply chain market [8][9][10] - Lam Research's memory segment is benefiting from rising demand for AI chips, while KLA Corporation's advanced process control solutions are also in demand due to AI and high-performance computing [9][10]
AMAT vs. KLAC: Which Semiconductor Equipment Stock is the Better Buy?
ZACKS· 2025-07-03 16:20
Core Insights - Applied Materials (AMAT) and KLA Corporation (KLAC) are significant players in the semiconductor equipment market, with AMAT focusing on equipment for deposition, etching, and inspection, while KLAC specializes in process control and metrology systems [1][2] Group 1: Applied Materials (AMAT) - AMAT is seeing strong traction in its Sym3 Magnum etch system and other advanced technologies crucial for AI and high-performance computing (HPC) workloads [3] - Since its launch in February 2024, AMAT's Sym3 Magnum etch system has generated over $1.2 billion in revenues, with projected revenue growth of over 40% from DRAM customers in fiscal 2025 [4] - AMAT's revenues from advanced semiconductor nodes exceeded $2.5 billion in 2024, with expectations to double in fiscal 2025 due to increased adoption of its GAA and backside power delivery solutions [4] - The company faces challenges from U.S. trade restrictions on semiconductor equipment sales to China, impacting its revenues from 200mm equipment and overall performance in the Chinese market [5][6] - The Zacks Consensus Estimate for AMAT indicates single-digit growth in both revenues and EPS for fiscal 2025, with year-over-year growth of 6% and 9.5%, respectively [7] Group 2: KLA Corporation (KLAC) - KLAC projects advanced packaging revenues of $850 million in 2025, up from $500 million in 2024, with a strong market share in process control [11][12] - The demand for AI chips is driving the need for KLAC's advanced process control solutions, which are expected to continue experiencing robust traction [12][13] - KLAC's EPS is projected to grow by 36.7% in fiscal 2025, significantly higher than AMAT's projected growth [11][15] - The semiconductor process control market is expected to grow at a CAGR of 7.2% from 2026 to 2033, with KLAC holding over 56% market share in 2024 [14] Group 3: Stock Performance and Valuation - Year-to-date, shares of AMAT and KLAC have gained 17.3% and 46.2%, respectively [17] - AMAT and KLAC are trading at forward 12-month price-to-sales multiples of 5.10X and 10.11X, above their one-year medians [19] - KLAC has a stronger market share and is rated higher with a Zacks Rank 2 (Buy), while AMAT holds a Zacks Rank 3 (Hold) [20]
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
Globenewswire· 2025-05-20 02:45
Core Insights - GlobalFoundries (GF) has signed a Memorandum of Understanding (MOU) with the Agency for Science, Technology and Research (A*STAR) to enhance its advanced packaging capabilities in Singapore [1][3] - The collaboration aims to address the growing demand for advanced packaging in the semiconductor industry, driven by applications in artificial intelligence (AI) and data-intensive technologies [2][4] - A*STAR will provide GF with access to R&D facilities and technical support, while GF will supply critical equipment to A*STAR, facilitating mutual growth in advanced packaging technologies [3][5] Company Developments - The partnership will enable skills enhancement initiatives for GF employees, focusing on developing expertise in advanced packaging [4][6] - This collaboration aligns with GF's global advanced packaging roadmap and its commitment to producing energy-efficient chips essential for AI applications [4][6] - GF's strategic roadmap includes the establishment of an Advanced Packaging and Photonics Center in New York, complementing the efforts in Singapore [6] Industry Context - Advanced packaging is a key R&D priority for the semiconductor industry, essential for delivering compact, high-performance, and energy-efficient solutions [2] - Singapore is positioning itself as a critical node in the global semiconductor supply chain, emphasizing the importance of R&D collaboration between public research and industry [5][6] - The partnership reflects a broader trend of nurturing high technology talent and continuous upskilling in response to evolving industry needs [4][5]