Summary of Conference Call on Taiwan Semiconductors and Companies WinWay and CHPT Industry Overview - The semiconductor industry is experiencing a paradigm shift where system performance is increasingly determined by interconnect density and power efficiency rather than just transistor scaling [2][12] - Advanced packaging has become a core architectural decision, moving from a backend consideration to a strategic bottleneck, creating a multi-year growth opportunity for interface leaders [2][12] Company Insights WinWay (Ticker: 6515.TW) - WinWay is recognized for its technical leadership in coaxial socket and hypersocket technologies, securing a position in the high-end AI GPU/ASIC supply chain [1][4] - The company is expected to benefit from the rising demand for advanced testing interfaces as AI chips evolve towards larger die sizes and higher thermal envelopes [1][4] - Target price set at NT$6,000 based on a 40x PE for 2027E, reflecting a projected earnings CAGR of 78% from 2025 to 2027 [4][21] - WinWay's dominance is attributed to its long-term partnerships with US AI GPU chipmakers and its strategic geographical proximity to Taiwan's semiconductor cluster [20][21] CHPT (Ticker: 6510.TWO) - CHPT is positioned to leverage its "All-in-House" integration capability to capture market share in the US AI GPU/ASIC testing process [1][4] - The company is expected to transition from a secondary supplier to a major supplier for next-gen AI CPU/GPU testing boards by 2026 [16][19] - Target price set at NT$5,000 based on a 40x PE for 2027E, with an estimated earnings CAGR of 102% from 2025 to 2027 [4][19] - CHPT has extended its technical edge into the high-value AI ASIC market and has entered the high-end burn-in board market [16][19] Key Market Dynamics - The transition to system-level testing (SLT) has become mandatory, creating a 4-5x volume multiplier for test sockets due to extended test durations [3][12] - The integration of advanced features such as 224G SerDes and 3,000W thermal envelopes is rendering traditional interfaces obsolete, favoring specialized companies like WinWay and CHPT [3][4] - The demand for high-performance test sockets is projected to grow at a CAGR of 6.1% from 2024 to 2029, with AI-specific sockets expected to outpace this growth [55][56] Financial Projections - WinWay's earnings for 2025-2027E are forecasted to grow at a CAGR of 78%, while CHPT's are expected to grow at 102% during the same period [4][19] - Both companies are positioned to capture significant value in the AI computing ecosystem due to their critical roles in the testing process [4][19] Risks and Considerations - Key risks for both companies include customer concentration and the potential for slow market expansion in system-level testing [21][19] - The evolving landscape of AI and HPC testing presents both opportunities and challenges, necessitating continuous innovation and adaptation [12][19] Conclusion - The semiconductor testing landscape is evolving rapidly, with WinWay and CHPT positioned as key beneficiaries of the AI supercycle. Their strategic advantages in testing interfaces and advanced packaging are expected to drive significant growth in the coming years [4][19][21]