Onto Innovation (NYSE:ONTO) FY Conference Summary Company Overview - **Company**: Onto Innovation (NYSE:ONTO) - **Event**: 28th Annual Needham Growth Conference - **Date**: January 13, 2026 Key Industry Insights - **AI Impact**: AI is a significant driver in the semiconductor industry, with NVIDIA projecting a 40% CAGR over the next few years, influencing demand and supply dynamics [6][7] - **Revenue Ties**: In 2025, 61% of Onto's revenue was derived from customers directly supporting the AI supply chain, indicating a strong correlation with AI growth [7] - **Market Outlook**: The outlook for 2026 is expected to be at least 10% stronger in the first half compared to the second half of 2025, reflecting improved customer sentiment [7] Product and Technology Developments - **AI Value Chain**: Onto is positioned in several areas of the AI value chain, including Gate-All-Around nodes, advanced packaging inspection, and 3D metrology [8][9] - **New Technologies**: The company is focusing on co-packaged optics and charge metrology, which are expected to contribute significantly to revenue growth, with an estimated additional opportunity of $1 billion [10][12] - **Dragonfly Platform**: The Dragonfly G3 has seen less decline than expected, with new applications being added. The upcoming Dragonfly G5 is expected to enhance resolution and throughput significantly [14][15] Financial Performance and Projections - **Operating Margin Improvement**: Onto aims for at least a 30% improvement in operating margin for 2026, driven by overseas manufacturing, new product value, and synergies from the SDI acquisition [18][19] - **Revenue Growth Drivers**: Growth is anticipated from advanced nodes and packaging, particularly in HBM and AI-related applications [21][30] Market Position and Competitive Landscape - **OSAT Engagement**: Onto is benefiting from the outsourcing of capabilities to OSATs, which are increasingly involved in AI packaging, enhancing Onto's market position [23][24] - **Lithography Business**: The JetStep system for panel-level packaging is gaining traction, with customers recognizing the importance of inline process control [25][27] Geopolitical Considerations - **China Exposure**: Onto's limited exposure to China provides some protection against geopolitical volatility, while the shift of manufacturing to Asia is expected to enhance engagement with Chinese customers [32][34] Customer Engagement and Value Proposition - **Value Quantification**: Onto emphasizes the importance of solving customer problems through reliable measurements and faster processing, which justifies their pricing strategy [36] - **Sustainable Advantage**: The company's understanding of customer challenges and its ability to address complex issues in packaging and inspection are seen as key differentiators in maintaining a competitive edge [37] Conclusion Onto Innovation is strategically positioned to leverage the growth in AI and advanced semiconductor technologies, with a strong focus on enhancing product capabilities and improving operational efficiencies. The company is optimistic about its growth trajectory in 2026, driven by innovative technologies and a robust market demand.

Summary of Onto Innovation (ONTO) 2025 Conference Call Company Overview - **Company**: Onto Innovation Inc. (ONTO) - **Industry**: Semiconductor Equipment Market Outlook - **2026 Growth**: Company is in discussions with customers regarding their expansion plans for 2026, indicating a focus on underlying growth waves rather than overall market trends [4][6] - **AI Demand**: Continuous growth in AI technology is noted, with no signs of slowing down [4] - **New Product Opportunities**: New products in 3D metrology and critical films are progressing well, with a significant market for critical films estimated at $500 million [5] Performance Insights - **Advanced Nodes Growth**: Company reported nearly 100% growth in advanced nodes, significantly outperforming peers [8][10] - **Revenue Drivers**: Growth attributed to expanding product offerings beyond traditional markets, including films and integrated metrology [9][10] Competitive Landscape - **Pricing Power**: Company is experiencing opportunities to increase prices due to advanced inspection requirements, contrary to typical pricing pressures [12][13] - **Market Share**: Company maintains strong market share across multiple HBM customers, with no significant share loss reported despite increased competition [27][28] Product Development - **Dragonfly G5 Tool**: The new Dragonfly G5 tool is expected to enhance market share in 2.5D packaging, with strong customer interest and impressive performance feedback [15][16][17] - **Hybrid Bonding**: The tool will address concerns over voids in hybrid bonding, presenting new opportunities for high-resolution inspections [19][20] Strategic Initiatives - **Semilab Acquisition**: Acquisition aims to enhance capabilities in surface charge metrology and materials characterization, with potential synergies expected [35][36] - **Market Growth in Materials Characterization**: Growing interest in materials characterization as advanced packaging and exotic materials become more prevalent [38][41] Financial Performance - **Gross Margin**: Current gross margin is below the long-term target of 56%-57%, with plans to improve through supply chain efficiencies and new product introductions [44][45] - **Capital Allocation**: Company prioritizes M&A as a key strategy for capital allocation, focusing on synergies and core competencies [53][55] Future Outlook - **Technology Transitions**: Company is focused on expanding its footprint across various markets rather than fixating on specific technology transitions [48][49] - **Packaging Investments**: Significant investments in packaging are anticipated, with a strong position in the market due to advancements in heterogeneous die and panel technology [50][51] Conclusion - **Investor Sentiment**: Company believes there has been an overreaction to competitive pressures, asserting confidence in its ability to maintain market position and drive growth through new product adoption [57]