DualPack 3 power modules
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New DualPack 3 IGBT7 Modules Deliver High Power Density and Simplify System Integration
Globenewswire· 2025-09-16 12:00
Core Insights - Microchip Technology has launched a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology, aimed at high-growth applications in motor drive, data centers, and sustainability [1][2] Product Features - The DP3 power modules are available in six variants with voltage ratings of 1200V and 1700V, and high current ratings ranging from 300A to 900A, designed for compact and cost-effective power converter solutions [1][3] - IGBT7 technology in these modules reduces power losses by 15-20% compared to previous IGBT4 devices and can operate reliably at temperatures up to 175°C during overload conditions [2] - The modules are designed to enhance protection and control during high-voltage switching, making them suitable for various applications including industrial drives, renewables, traction, energy storage, and agricultural vehicles [2] Design and Integration - The DP3 modules feature a compact footprint of approximately 152 mm × 62 mm × 20 mm, allowing for increased power output without the need for paralleling multiple modules, thus reducing system complexity and Bill of Materials (BOM) costs [3] - These modules provide a second-source option to industry-standard EconoDUAL™ packages, offering greater flexibility and supply chain security for customers [3] - The modules can be integrated with Microchip's microcontrollers, microprocessors, and other components to streamline the design process and accelerate development time [4] Availability - The DualPack 3 power modules are now available in production quantities and can be purchased directly from Microchip or through authorized distributors [6]