Core Insights - DuPont's Electronics business, Onity, has signed a Memorandum of Understanding (MOU) with SK hynix for a long-term supply agreement of polishing pads for chemical mechanical planarization (CMP) in semiconductor manufacturing [1][2][3] - This agreement aims to support SK hynix's advanced semiconductor manufacturing needs and reflects a continuation of their longstanding collaboration [2][3] - Onity is set to be separated from DuPont on November 1, 2025, creating an independent company focused on semiconductor technologies [4][9] Company Developments - The MOU was signed during SEMICON West in Phoenix, Arizona, with key executives from both companies in attendance [3] - Onity is recognized as a leader in CMP technology, offering products such as the Emblem CMP pad platform, designed for AI and advanced computing applications [4] - The upcoming separation of Onity from DuPont is part of a strategic move to enhance focus on the semiconductor sector and its innovations [9][11] Industry Context - The collaboration between DuPont and SK hynix is positioned to advance the semiconductor and electronics industries through enhanced CMP materials [2][3] - The demand for advanced CMP pads is driven by the growing memory business of SK hynix, indicating a robust market for semiconductor manufacturing solutions [2] - The launch of next-generation CMP products like the Emblem pads highlights the industry's shift towards high-performance materials for emerging technologies [4]