Group 1 - The SEMICON Taiwan 2025 event opened on September 10, featuring the theme "World Together, Innovation Starts," with over 1,200 companies and 4,100 booths, attracting more than 100,000 professionals, marking the largest scale in history [1] - New Yichang (688383.SH) showcased multiple core devices at the event through its subsidiaries, including Flip chip bonding machines, K580 aluminum wire bonding machines, and testing and sorting equipment, demonstrating the company's technological strength and product layout in the semiconductor packaging and optical communication fields [3] - On the first day of the exhibition, New Yichang's booth received numerous industry experts and both new and old customers, leading to enthusiastic exchanges and valuable feedback that will provide important directions for future product development and technological upgrades [5]