Summary of Key Points from the Conference Call Industry and Company Involved - The discussion focuses on the liquid cooling solutions for the GB300 and GB200 systems, particularly involving companies like NVIDIA, Cooler Master, and AVC. Core Insights and Arguments 1. **Changes in Liquid Cooling Solutions**: The GB300 liquid cooling solution has significant changes compared to the GB200, particularly in the design of the cold plates and the use of quick connectors [1] 2. **Quick Connector Configuration**: Each compute tray in the GB200 system uses a liquid cooling design with a pair of quick connectors, with multiple loops connected through a manifold [2] 3. **Quick Connector Pricing**: The price of quick connectors in the GB200 system has decreased from approximately $100 to a range of $70 to $80 [6] 4. **Supplier Determination**: The quick connector suppliers are determined by the design party, with NVIDIA primarily using products from CPC and Staubli [7] 5. **GB300 Design Changes**: The GB300 features independent cold plates for each chip, requiring a total of 14 pairs of quick connectors per compute tray, leading to a total of 252 pairs for the NVL72 system [8] 6. **New Quick Connector Pricing**: The new NV UQD03 quick connectors in the GB300 have a reduced price of $40 to $50, significantly lower than previous models [8] 7. **Initial Production Suppliers**: Key suppliers in the initial production phase of the NV UQD03 include Cooler Master, AVC, and Readore, with Cooler Master taking a leading role [9] 8. **Cooler Master’s Progress**: Cooler Master has advanced quickly in the GB300 project due to its close collaboration with NVIDIA, which is responsible for the core design [10] 9. **GB200 Project Participants**: The GB200 project was initially led by Intel and several cloud service providers, with CPC being a significant player in the quick connector manufacturing [11] 10. **Supply Chain Changes for GB300**: The GB300 did not follow the GB200 supply chain due to the complexity of the new design and the need for more rigorous testing [12] 11. **Current Supplier Progress**: Cooler Master is leading the verification phase for the GB300 project, while AVC and Readore are still in the initial verification stages [13] 12. **Cooler Master’s Supply Chain**: The specifics of Cooler Master’s Tier 2 supply chain support remain unclear, with some factories located in mainland China [14] 13. **UQD03 Design Rationale**: The UQD03 was designed to be smaller to accommodate increased board slot numbers, but this may increase the risk of leakage due to tighter sealing requirements [15] 14. **Significant Changes in GB300**: The main changes in GB300 focus on the internal cold plate design, while other components like the manifold and CDU remain unchanged from GB200 [16] 15. **Future Cooling Solutions**: There is a potential shift towards water cooling for transceiver connectors, which could increase manufacturing complexity and costs [17] Other Important but Overlooked Content - The complexity of the assembly process has increased due to the smaller size of the quick connectors, which requires more precise assembly and additional reliability testing [12][15] - The transition to water cooling for transceivers is still in the design phase, indicating that the final implementation is not yet determined [17]