Core Insights - Applied Materials has acquired 9 percent of the outstanding shares of BE Semiconductor Industries N.V. (Besi) to strengthen their collaboration on hybrid bonding technology for advanced packaging [1][2] Company Collaboration - The partnership between Applied Materials and Besi began in 2020 and has recently been extended to co-develop the first fully integrated equipment solution for die-based hybrid bonding, which is essential for creating energy-efficient semiconductor chips [2][3] - Hybrid bonding technology connects chips using direct copper-to-copper bonds, enhancing density and reducing interconnect wiring lengths, leading to better performance, lower power consumption, and cost efficiency [2] Strategic Investment - The investment is viewed as a strategic, long-term commitment by Applied Materials to advance hybrid bonding solutions, which are increasingly vital for advanced logic and memory chips, particularly in the context of AI development [3] - The integrated hybrid bonding system co-developed by both companies is designed to meet the high-volume manufacturing needs of chipmakers, combining Applied's wafer processing expertise with Besi's precision bonding capabilities [3] Transaction Details - The share purchase was executed through market-based transactions and does not require regulatory approvals. Applied Materials does not plan to seek board representation at Besi or acquire additional shares [4]