Core Insights - SuperX, an AI infrastructure solutions provider listed on NASDAQ, has launched the SuperX GB300NVL72 system, a rack-level AI supercomputing platform designed to overcome the physical and computational limits faced by trillion-parameter large models [1][2] - The system utilizes NVIDIA's GB300Grace Blackwell Ultra chips and marks a transition from traditional air cooling and AC power distribution to a liquid cooling rack era, emphasizing the importance of power and cooling systems as core components of next-generation AI workloads [1] Group 1 - The SuperX GB300 system is designed for large-scale horizontal expansion, connecting 72 Blackwell Ultra GPUs into a single massive GPU system, achieving 1.8 exaFLOPS of FP4 AI computing power within a single rack [2] - The advanced liquid cooling design is essential for sustaining the operation of this high-performance system, as it efficiently removes the significant heat generated by the chips, ensuring continuous 24/7 operation [2] - The SuperX GB300NVL72 system targets several key areas in future AI computing, including large-scale sovereign AI, exascale scientific computing, and industrial digital twins in sectors like automotive, high-end manufacturing, and energy [2]