Core Insights - The collaboration between Deca Technologies and Silicon Storage Technology (SST) aims to innovate a comprehensive non-volatile memory (NVM) chiplet package to enhance customer adoption of modular, multi-die systems [1][4] - This partnership combines Deca's M-Series™ fan-out and Adaptive Patterning technologies with SST's SuperFlash embedded flash technology, providing a bundled offering that enhances architectural flexibility and offers technical and commercial advantages over traditional monolithic integration [2][3] Company and Industry Overview - Chiplet technology is gaining traction in the semiconductor industry as it allows for more efficient and cost-effective product designs by enabling the combination of different chips, process nodes, and sizes [5] - The collaboration supports customers from early design through qualification and prototype manufacturing, aiming to streamline integration and accelerate design cycles for broader adoption of heterogeneous integration [4][6] - The partnership is positioned to deliver a comprehensive package of intellectual property (IP), simulation tools, and advanced assembly and engineering services necessary for successful chiplet development and productization [6]