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ROHM Releases DOT-247: Integrated 2-in-1 SiC Molded Module for Industrial Applications
Globenewswire· 2025-09-16 21:30
Core Insights - ROHM Semiconductor has developed the DOT-247, a new 2-in-1 SiC molded module aimed at industrial applications such as PV inverters, UPS systems, and semiconductor relays [1][16] - The DOT-247 features a dual TO-247 structure that allows for larger chip integration, achieving lower on-resistance and reducing thermal resistance by approximately 15% and inductance by about 50% compared to conventional TO-247 solutions, resulting in a 2.3x higher power density in a half-bridge configuration [2][3] Product Features - The DOT-247 is available in two topologies: half-bridge and common-source, addressing the rising demand for multi-level circuits in PV inverters [3][4] - The module's design reduces the number of components and board space, facilitating circuit miniaturization compared to discrete solutions [4] Application Examples - The DOT-247 is suitable for various applications including PV inverters, semiconductor relays, UPS, ePTO, boost converters for fuel cell vehicles, AI servers, and EV charging stations [5] Sales Information - The DOT-247 will be available in OEM quantities starting September 2025, with AEC-Q101 qualified products scheduled for sample shipments in October 2025 [6] Comprehensive Support - ROHM provides extensive application-level support, including in-house motor testing equipment and various supporting materials such as simulations and thermal designs for quick evaluation and adoption of DOT-247 products [7] - An evaluation kit for double-pulse testing is available, with a kit for 3-phase inverters under preparation, and reference designs expected to be released from November 2025 [7] Design Models - SPICE models for the DOT-247 are available on the product page, with LTspice models for three-level NPC expected to be available starting October 2025 [8] EcoSiC™ Brand - EcoSiC is ROHM's brand for silicon carbide devices, which are recognized for their superior performance compared to silicon, with ROHM developing essential technologies for SiC evolution and maintaining an integrated production system [9]