Core Insights - Taiwan Semiconductor Manufacturing Company Ltd. (TSM) is set to report its second-quarter 2025 earnings on July 17, with a strong focus on advanced semiconductor technologies and increasing demand for AI chips across various sectors, indicating potential robust financial results [1] Revenue Projections - TSM projects revenues between $28.4 billion and $29.2 billion for the second quarter, reflecting a year-over-year increase of 38.3% at the midpoint, while the Zacks Consensus Estimate stands at $30.04 billion, suggesting a year-over-year growth of 44.3% [2][10] Demand for Advanced Chips - The rising adoption of AI in cloud services, personal electronics, and data centers has significantly increased the demand for high-performance chips, benefiting TSM as the world's largest contract chipmaker, particularly due to its leadership in advanced chipmaking technologies like the 3-nm and 5-nm nodes [3][10] AI-Focused Product Demand - TSM has experienced strong demand for its AI-focused products, including Chip-on-Wafer-on-Substrate advanced packaging solutions, with demand consistently exceeding supply, highlighting the company's essential role in AI and high-performance computing applications [4] Margin Pressures - Rising operational costs from TSM's global expansion into Arizona, Japan, and Germany are expected to negatively impact gross margins by 2-3% annually over the next three to five years due to higher labor and utility costs and lower initial utilization rates [5] - Additionally, higher energy prices in Taiwan, following a 25% electricity hike in 2024, present further challenges, especially as advanced nodes require more power [6] Earnings Outlook - Despite the challenges, analysts remain optimistic about TSM's bottom-line growth, with the Zacks Consensus Estimate for second-quarter earnings revised upward by 5 cents to $2.37 per share, indicating a year-over-year growth of 60.1% [7]

14 July 2025 | 8:29AM CST Shennan Circuits (002916.SZ): 2Q Preview: AI PCB to drive a solid 2Q; BT price hike to be an incremental driver into 3Q; Buy For 2Q25E results, we expect revenue to grow 19% YoY to Rmb5.2bn and net profit to be flattish at -1% YoY off a high base, with gross margin at 25.3%, representing a slight increase QoQ, driven by product mix improvements. Into the earnings, we focus on 1) BT substrate pricing optimization on the back of improving demand and rising raw material costs; 2) AI P ...

4 July 2025 | 3:42PM CST Greater China Technology BT substrate pricing hike in 3Q driven by raising material cost; raise TP for all substrate players Most BT substrate prices increased by 5%-20% in early 3Q, driven mainly by the tightness of the key raw material T-glass (leadtime now is 15-20 weeks+ from 3-6 weeks normally, and the price went up by 10-20% if not LTA pricing in 2Q25) and the hike in gold pricing (spot price from ~US$2,700 per ounce in early 2025 to US$3,300 per ounce now; Exhibit 2) while T- ...

Core Insights - KLA Corporation (KLAC) shares have increased by 42.6% year to date, outperforming the Zacks Electronics - Miscellaneous Products industry's growth of 12.3% and the Zacks Computer and Technology sector's growth of 6.8% [1] - The company's strong performance is attributed to high demand for EUV reticle inspection, substrate metrology, and advanced process control tools, driven by increasing chip complexity and AI-driven design transitions [3][6] Financial Performance - KLA's wafer inspection revenues surged 51% year over year to $1.5 billion, accounting for nearly half of the company's total revenues [7][9] - For the fourth quarter of fiscal 2025, KLA expects revenues of $3.075 billion, with a non-GAAP earnings estimate of $8.53 per share, indicating a year-over-year growth of 29.24% [11][12] Market Position - KLA's advanced packaging revenues are projected to exceed $850 million in 2025, reflecting a growing demand for solutions that enable 2.5D and 3D integration [7] - The company is well-positioned to benefit from packaging-related equipment demand due to expanding investments in Foundry, Logic, and DRAM to support AI workloads [8] Competitive Landscape - KLA's shares have outperformed industry peers such as Garmin, Tokyo Electron, and SMC Corporation, which have seen lower appreciation rates [2] - KLAC is trading at a forward price/sales ratio of 9.83X, significantly higher than the industry's 3.2X, indicating a premium valuation compared to competitors [13] Growth Drivers - The adoption of KLA's EUV and substrate inspection systems is gaining momentum, driven by rising complexity at leading-edge nodes [10] - Strong demand for AI-linked tools and packaging systems is driving KLA's advanced revenue projections [7][15]

芯片超人组织的日本商务考察活动 正在招募！12月出发，为期 6天，重点参加 SEMICON Japan 2025，并 实地走访日本当地知名半导体企业与高校，挖掘日本半导体产业芯机会！ 点击上图查看活动详情，或联系客服咨询：ICSuperman88。 作者简介： 汤之上隆先生为日本精密加工研究所所长，曾长期在日本制造业的生产第一线从事半导体研发工作，2000年获 得京都大学工学博士学位，之后一直从事和半导体行业有关的教学、研究、顾问及新闻工作者等工作，曾撰写 《日本"半导体"的失败》 、 《"电机、半导体"溃败的教训》 、 《失去的制造业：日本制造业的败北》 等著 作。 0 1 Rapidus不仅涉足前道工艺 还进军后道工艺 国际半导体封装及后道工艺技术会议"ICEP-IAAC2025"于2025年4月在日本长野县举办，据报 道，Rapidus在该会议的主旨演讲中进行发言： "半导体代工厂Rapidus正在加速开发最先进的封装技术。为 了 在高速成长的生成式人工智能 （AI） 市场中，赢得GAFAM （ Google ， Apple ， Facebook 现已更名为Meta ， Amazon和 Microsof ...

June 25, 2025 02:20 AM GMT Investor Presentation | Japan Semiconductor Production Equipment: Tech Monthly June 2025 M Foundation Morgan Stanley MUFG Securities Co., Ltd.+ Tetsuya Wadaki Equity Analyst Tetsuya.Wadaki@morganstanleymufg.com +81 3 6836-8890 Semiconductor Production Equipment Japan Industry View Attractive Morgan Stanley does and seeks to do business with companies covered in Morgan Stanley Research. As a result, investors should be aware that the firm may have a conflict of interest that could ...

Investment Rating - Industry View: In-Line [3] Core Insights - Japanese electronic component companies are distinguished by their value-added products, which are characterized by more layers and components that are smaller, thinner, lighter, and more durable [5][11] - The demand for high-performance computing and data centers is expected to accelerate due to advancements in deep learning and AI [5][11] - The automotive sector is transforming into mobile communication and sensor devices, necessitating more sophisticated components [5][11] - The rise of 5G smartphones and AI smartphones will require components that are more value-added, smaller, thinner, and lighter [5][11] - AI smartphones and AI PCs will demand higher electric power and batteries with increased capacity [5][11] Summary by Sections Market Demand - There is a growing need for value-added components in high-performance computing, AI smartphones, and automotive applications [13][14] - The server market is experiencing growth driven by AI servers that require high value-added components [31] Component Specifications - High-performance computing requires more advanced ABF (flip chip) package substrates for CPUs and GPUs [14] - The automotive sector, including ADAS and electric vehicles, requires durable components with enhanced value [14] - AI smartphones are projected to consume more electricity and necessitate batteries with higher energy density, such as silicon anode lithium batteries [14] Market Share and Growth - Murata held a 47% market share in MLCCs in 2023, an increase from 28% in 2004, showcasing its leadership in value-added products [14] - The total sales in the electronic components market for F24 reached JPY 12,548.1 billion, with significant contributions from various sectors including smartphones and automotive [16] Component Usage - The number of components required in various applications highlights the importance of MLCCs, with smartphones requiring approximately 1,000 MLCCs per device [18] - The automotive sector can require between 5,000 to 8,000 components, emphasizing the complexity and demand for high-quality parts [18] Future Trends - The shift towards Chiplets in HPC semiconductors is anticipated, which will involve more complex packaging solutions [14] - Business opportunities in the mobility industry utilizing IoT technology are expected to expand, leading to increased demand for high-performance modules [14]

S/D model update on silicon wafer, SiC substrate, GaN. China capacity and implications to global players As a global team, we review and refresh our S/D model across (1) silicon wafers, (2) SiC substrate, (3) GaN devices, and (4) IGBT (Exhibits 8, 10, 12, 32). Key conclusions: (1) Chinese in China: Local coverage (local production/ local demand) of 12-inch silicon wafer/ 6-inch SiC substrate to grow from 41%/ 80% in 2024 to 54%/ 87% in 2027E. (2) Pricing: 8-inch silicon wafer ASP to decline 10% CAGR in 2024 ...

Core Insights - Safe and Green Development Corporation (SGD) has appointed three new members to its Board of Directors, enhancing its strategic direction following the acquisition of Resource Group US Holdings LLC [1] - The new directors, Bjarne Borg, James D. Burnham, and Anthony M. Cialone, bring extensive experience in real estate development, environmental engineering, private equity, and renewable technologies [1][5] Company Overview - Safe and Green Development Corporation focuses on real estate development, particularly in acquiring and investing in properties for green housing projects across the United States [6] - The company wholly owns Resource Group US Holdings LLC, which operates an 80+ acre organics processing facility in Florida, processing green waste and producing sustainable potting media [6] New Board Members' Backgrounds - Bjarne Borg has over 35 years of experience in real estate and renewable energy, co-founding Index Investment Group and serving on various advisory boards [2] - James D. Burnham has over 30 years of experience in mergers and acquisitions, primarily in the solid waste industry, and has co-founded Encell Composites [3] - Anthony M. Cialone has over 30 years of executive leadership experience, focusing on corporate operations and strategic planning, and has held multiple leadership roles in various companies [4]

业界最新消息指出，力成已经将旗下FOPLP技术正式定名PiFO，技术类似台积电的CoPoS，透过 不同名称与其他业者做出区隔。事实上，力成在该技术耕耘最久，早在2019年实现量产。力成先 前也强调，目前全球真正具大规模FOPLP生产能力的业者仅有公司一家，并看好未来在AI世代 中，高阶逻辑芯片的异质封装，将采用更多FOPLP解决方案。 台积电部分，尽管对外尚未详细解释在面板级封装的技术细节， 但MoneyDJ早前已率先掌握 ，其 预计在2026年设立首条CoPoS实验线，并将落脚旗下采钰(6789)，而真正大规模生产的量产厂也 已 敲 定 将 落 脚 在 嘉 义 AP7 ， 目 标 2028 年 底 至 2029 年 之 间 实 现 大 规 模 量 产 ， 首 家 客 户 将 由 辉 达 (NVIDIA)拔得头筹。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 MoneyDJ 。 继CoWoS后，FOPLP(扇出型面板级封装)成为近来最受嘱目的先进封装技术。据业界消息，在该 技术上，主要竞争的三大厂在命名上也各有千秋，其中，台积电(2330)取名为CoPoS(Chip-on- Panel-on ...