Synopsys 3DIC Compiler™

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Synopsys Collaborates with TSMC to Enable 2D and 3D Design Solutions
Prnewswire· 2025-09-24 20:05
Core Insights - Synopsys has announced that TSMC has certified its Ansys portfolio for advanced chip design, enhancing workflows for AI, high-speed communications, and advanced computing [2][9] - The collaboration includes the development of an AI-assisted design flow for TSMC's COUPE platform, aimed at improving design efficiency and quality [2][4] Advanced Technology Collaboration - TSMC's advanced manufacturing processes, including N3C, N3P, N2P, and A16, are supported by Ansys RedHawk-SC and Ansys Totem for power integrity verification [5][8] - Ansys HFSS-IC Pro is certified for die-level analysis on TSMC's 5nm and 3nm processes, facilitating complex applications in AI, HPC, and telecommunications [7][8] Design Optimization Tools - Ansys optiSLang and Ansys Zemax OpticStudio are utilized for AI-assisted optimization in optical coupling systems, reducing design cycle times [4][8] - The multiphysics analysis flow, including Ansys RedHawk-SC and Synopsys 3DIC Compiler, enhances thermal-aware and voltage-aware timing analysis for large 3DIC designs [3][6] Future Developments - Synopsys and TSMC are collaborating on design flow development for TSMC's A14 process, with the first photonic design kit release expected in late 2025 [5] - Ansys PathFinder-SC is a newly certified tool for ESD current density checking, aimed at improving chip resilience and accelerating the design process [6]