Core Insights - Lam Research Corp. celebrated the opening of a new $65 million office building in Tualatin, Oregon, marking its latest expansion in the U.S. semiconductor market, which is projected to reach $1 trillion in the coming years [1][2][3] Company Expansion - The new Building G adds up to 700 workspaces for current and future employees, enhancing Lam's research and development operations in Tualatin [2] - The four-story, 120,000-square-foot facility is part of a multi-year strategy to improve infrastructure and facilities near customers [2] Commitment to Innovation - Lam Research's growth in the Silicon Forest underscores its commitment to customers, employees, and local communities, positioning itself as a leader in semiconductor manufacturing equipment and process development [3] - The company has been instrumental in developing advanced semiconductor fabrication processes, including innovations that allow for features on chips over 1,000 times smaller than a grain of sand [6][7] Community Engagement - Local officials and community leaders highlighted Lam's role in supporting Oregon's economy and its commitment to fostering future talent through partnerships with academic institutions [3][4]

Core Insights - Lam Research Corporation reported a revenue of $5.32 billion for the September 2025 quarter, reflecting a 3% increase from the previous quarter [2][4][9] - The company achieved a U.S. GAAP gross margin of 50.4% and a diluted EPS of $1.24, while non-GAAP gross margin was 50.6% with a diluted EPS of $1.26 [4][5][9] - The CEO highlighted the company's strong positioning for growth driven by innovations in semiconductor manufacturing, particularly in AI [5] Financial Performance - U.S. GAAP revenue for the September 2025 quarter was $5,324 million, up from $5,171 million in June 2025 [2][4] - Gross margin increased to $2,685 million, representing 50.4% of revenue, compared to 50.1% in the previous quarter [2][4] - Operating income as a percentage of revenue rose to 34.4%, with net income reported at $1,569 million [2][4][17] Non-GAAP Results - Non-GAAP gross margin was $2,694 million, or 50.6% of revenue, compared to 50.3% in the previous quarter [3][4] - Non-GAAP operating income was 35.0% of revenue, with net income at $1,605 million, translating to $1.26 per diluted share [3][4] Cash Flow and Balance Sheet - Cash, cash equivalents, and restricted cash increased to $6.7 billion at the end of the September 2025 quarter, up from $6.4 billion [5][18] - Deferred revenue rose to $2.77 billion, indicating a strong future revenue stream [6][18] Revenue Distribution - Revenue distribution by region for the September 2025 quarter was as follows: China (43%), Taiwan (19%), Korea (15%), Japan (10%), United States (6%), Southeast Asia (5%), and Europe (2%) [7] - Systems revenue was $3.55 billion, while customer support-related revenue was $1.78 billion [7][8] Outlook - For the quarter ending December 28, 2025, the company provided guidance of approximately $5.20 billion in revenue, with a gross margin of 48.4% [9][10]

Core Insights - Lam Research Corporation (NASDAQ:LRCX) has introduced VECTOR® TEOS 3D, a new deposition method aimed at solving complex packaging challenges in AI and high-performance computing chip manufacturing [1][2] - The new system utilizes Lam Equipment Intelligence® technology and a unique wafer handling technique to create ultra-thick, void-free inter-die gapfill films, significantly enhancing yield and scalability [1][2] Technology and Performance - VECTOR® TEOS 3D allows for single-pass deposition of crack-free films larger than 30 microns, with the capability to produce films up to 60 microns and scalability beyond 100 microns [1] - The quad station module architecture increases throughput by approximately 70% and reduces total cost of ownership by up to 20% [1] Market Context - The semiconductor industry is shifting towards 3D stacking and chiplet architectures to improve performance and space utilization, driven by rising demand for AI [2] - Lam Research's TEOS 3D addresses yield issues associated with wafer bow and film cracking, providing nanoscale precision and energy-efficient RF generators [2]