Core Viewpoint - Smartkem has entered into a preliminary Joint Development Agreement (JDA) with Manz Asia to co-develop next-generation dielectric ink solutions for advanced packaging manufacturing, particularly for AI chip applications [1][2] Company Overview - Smartkem is focused on revolutionizing electronics with a new class of transistors using proprietary advanced semiconductor materials, specifically TRUFLEX® semiconductor polymers, which enable low-temperature printing processes [4][5] - The company has a strong intellectual property portfolio, including 140 granted patents across 17 families, 14 pending patents, and 40 codified trade secrets [6] Industry Context - The collaboration aims to address critical bottlenecks in advanced computer and AI chip packaging by combining Smartkem's semiconductor materials with Manz's precision inkjet technology [2] - The demand for AI computing is driving the need for advancements in 12" wafer-level packaging and large-area panel packaging, which could transform data center infrastructure [2] Joint Development Agreement Details - The JDA is focused on developing scalable, high-performance solutions that enhance manufacturing paradigms, aiming for higher yield and lower cost per packaged chip [2] - The agreement is preliminary and non-binding, with no assurance of a definitive agreement or project outcome [3] Manz Asia Overview - Manz Asia is a leading manufacturer of advanced semiconductor equipment, specializing in CoPoS technology for panel-level packaging [7][8] - The company provides comprehensive equipment solutions that enhance production efficiency and optimize process quality in semiconductor packaging [9]