microchannel lid (MLCP)
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全球 AI 趋势追踪:AI 专家电话- 液冷市场更新-Global AI Trend Tracker_ AI Expert Call #60_ liquid cooling market updates
2026-02-11 15:40
Summary of Key Points from the Conference Call on Liquid Cooling Market Industry Overview - The conference call focused on the liquid cooling market, particularly in relation to major players like NVIDIA and various Cloud Service Providers (CSPs) [1][2]. Key Takeaways NVIDIA's Liquid Cooling Solution Roadmap - NVIDIA is advancing its liquid cooling solutions, with a roadmap that includes partnerships with key suppliers such as Vertiv, Motivair, CoolIT, Boyd, and Delta [3]. CSPs' Liquid Cooling Solutions - The competition for Coolant Distribution Units (CDUs) in the North American market is expected to intensify by 2026 [3]. - Google has been deploying liquid cooling solutions for five years, now primarily using liquid-to-liquid solutions, with its CDU reaching the fifth generation and capable of handling 2,000 kW of power [5]. Supply Chain Dynamics - Certain Chinese suppliers have been shortlisted for Google’s liquid cooling solutions, although order allocations are not finalized [3]. - Other CSPs are still primarily using air-to-liquid solutions but are expected to transition to liquid-to-liquid solutions as their power requirements increase [5]. Pricing Trends - The price of air/liquid cooling solutions in China can be less than 50% of that in the North American market [6]. - Capital expenditure (capex) for air cooling solutions in China is approximately RMB 2,000-3,000 per kW, while in North America it is RMB 4,000-5,000 per kW. For liquid cooling, capex in China is around CNY 4,000-5,000 per kW, compared to over CNY 10,000 in the US [6]. Technological Advancements - Vera Rubin's rack power capacity has increased from 130 kW-140 kW to 220 kW-230 kW, indicating a shift from liquid-to-air to liquid-to-liquid cooling solutions [5]. - The microchannel lid (MLCP) solution may be implemented on the Rubin Ultra platform in the near future, while the Vera Rubin chip can utilize an upgraded cold plate to meet cooling requirements for chips with power less than 3 kW [5]. Additional Insights - The demand for chiller products is decreasing, which contributes to reduced total power consumption and improved Power Usage Effectiveness (PUE) [5]. - The competitive landscape in the liquid cooling market is becoming more intense, particularly in China, which may affect pricing and supplier dynamics [6]. This summary encapsulates the critical insights from the conference call regarding the liquid cooling market, highlighting the competitive landscape, technological advancements, and pricing trends.