Workflow
大族数控(301200) - 2024年7月12日投资者关系活动记录表

Group 1: New Product Development - The company has completed the development of new products such as the compression system and online double-sided optical inspection machine, expanding its coverage of key processes and entering the vacuum compression equipment and optical inspection equipment markets [2] - Continuous promotion of advanced products like the twelve-axis mechanical drilling machine and four-beam CO2 laser drilling machine, providing cost-effective solutions for the PCB industry [2][3] Group 2: HDI Market and IC Packaging Progress - The HDI market is experiencing increased application scenarios and technical challenges, such as increased layer counts and reduced blind hole diameters [3] - The company has launched several upgraded products for HDI, achieving batch orders from well-known domestic HDI enterprises and increasing market share [3] Group 3: Overseas Market Expansion - PCB manufacturers are accelerating overseas expansion, particularly in Southeast Asia, with many projects entering the equipment evaluation stage [3] - The company is actively establishing local operations and has reached cooperation intentions with several PCB companies in Southeast Asia, anticipating significant growth in overseas sales [3] Group 4: Development Strategy - The company aims to deepen its focus on multilayer board market value and enhance innovation to exceed customer expectations [3] - Emphasis on high-growth, high-tech barrier markets such as HDI boards and IC packaging boards, developing competitive intelligent manufacturing solutions covering the entire PCB production process [3]