Group 1: Company Performance Overview - In the first half of 2024, the company capitalized on structural opportunities in the industry, resulting in a year-on-year increase in orders and maintaining a good capacity utilization rate [2] - Business revenue achieved a year-on-year growth, supported by the accelerated evolution and deepening application of AI, along with the upgrade of general servers, which optimized the product structure and improved profits [2] Group 2: PCB Business Development - The company focuses on high-end PCB design, research, and manufacturing, with core downstream applications in communication equipment, particularly in data centers (including servers) and automotive electronics [2] - Since Q1 2024, there has been no significant improvement in demand for wireless communication base station products compared to Q4 2023, while demand for wired products like switches and optical modules has increased [3] Group 3: Impact of AI on PCB Business - The acceleration of AI and its deepening application has led to a growing demand for high computing power and high-speed networks in the ICT industry, influencing the demand for PCB products in high-speed communication networks, data center switches, AI accelerator cards, and storage [3] Group 4: Automotive Electronics Expansion - Automotive electronics is a key area for the company's PCB business, targeting both domestic and overseas Tier 1 customers, with a focus on new energy and ADAS, producing high-frequency, HDI, rigid-flex, and thick copper products [3] - The company continues to seize opportunities in the new energy and ADAS PCB sectors, focusing on the development of target customers and the release of project demands [3] Group 5: HDI Process Capabilities - The company possesses HDI process capabilities, including Any Layer interconnection, primarily applied in communication, data centers, industrial control, medical, and automotive electronics sectors [3] Group 6: Packaging Substrate Business - Since Q1 2024, the demand for BT-type products in the packaging substrate business has continued the trend from Q4 2023, with orderly progress in production line validation and sample certification for FC-BGA packaging substrates [3] Group 7: Raw Material Price Stability - From 2023 to Q1 2024, the overall price of major raw materials remained stable, although some prices for precious metals and certain board materials have shown an upward trend, which has not yet significantly impacted the company's operations [4] Group 8: Thailand Project Development - The company is investing 1.274 billion RMB in a factory in Thailand to expand its overseas market and meet international customer demands, with construction work currently underway [4]
深南电路(002916) - 2024年7月25日投资者关系活动记录表