USC(SH:688403)2024-08-07 09:44Group 1: Convertible Bond Issuance - The company is issuing convertible bonds with an initial conversion price of ¥7.70 per share, determined based on the average trading price over the previous 20 trading days [4] - The bond issuance period starts on August 13, 2024, and lasts until August 6, 2030 [4] - The expected new revenue from the fundraising project is approximately ¥451.42 million, primarily from OLED display driver chip packaging and testing services [6] Group 2: Capacity and Market Strategy - The company has implemented measures to absorb new production capacity, including increased R&D investment and enhanced marketing services [4] - The compound annual growth rate (CAGR) for OLED display driver chip shipments in mainland China is projected at 35.54%, with shipments expected to rise from 80 million units in 2016 to 780 million units by 2025 [5] - The company is strengthening partnerships with major domestic clients to capture market share in the rapidly growing OLED sector [5] Group 3: Talent and Technology Management - The company emphasizes talent management and has implemented an employee stock incentive plan to attract and retain key personnel [5] - To protect intellectual property, the company has established confidentiality agreements and patent registrations for core technologies [6] - The company is focusing on domestic equipment procurement to stabilize the supply chain and reduce reliance on imports [5] Group 4: Financial and Operational Strategies - The company plans to manage the dilution of immediate returns through strict fundraising management and timely project implementation [7] - Measures to enhance operational efficiency and profitability in light of increased depreciation from new fixed assets are being prioritized [8] - The company aims to maintain a competitive edge in the 12-inch advanced process display driver chip sector through continuous innovation and technology development [7]